The ChipList, by Adrian Offerman; The Processor Portal

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Intel Itanium Processor Roadmap

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Itanium 2 9100 series Montvale

Successor of Itanium 2 9000 series Montecito processors.

Dual-Core technology.

Core Level Lockstep (CLL): two cores running in lockstep for fault-tolerant computing.

2-way multi-threading, compare Hyper-Threading Technology (HTT).

166/667 MHz QDR Front-Side Bus (FSB).

Power management: Enhanced Intel SpeedStep Technology (EIST; Demand-Based Switching, DBS).

Introduction date: week 44 2007.

Manufacturing technology: 90 nm.

Tukwila

Quad-Core successor of Itanium 2 9100 series Montecito processor generation.

New features: Reliability, Availabiliy, and Serviceability/Scalability/Security (RAS).

2-way multi-threading, compare Hyper-Threading Technology (HTT).

Separate instruction and data cache (Harvard architecture).

Integrated FB-DIMM memory controller, enabling memory local to small group of processors as well as non-uniform memory links between as many as 128 processors over a more widely distributed system.
Up to six QuickPath channels (QPI: QuickPath Interconnect; CSI: Coherent Scalable Interconnect / Common System Interconnect/Interface):
high-speed interconnect on Itanium and Xeon processors (Nehalem, from 2008), replacing current Front-Side Bus (FSB).
Compare (AMD) HyperTransport bus.
Itanium CSI not plug-and-play compatible with Xeon CSI, but the two processors will have a common chipset.

Double Device Data Correction (DDDC, memory RAS): data recovery for two sequential DRAM devices.

Introduction date: Q4 2008, first samples in 2007.

Manufacturing technology: 65 nm.

Poulson

Succesor of Tukwilla processor generation.

Multi-core technology: 6 to 10 cores.

Introduction date: ~2010.

Manufacturing technology: 32 nm, skipping 45 nm manufacturing technology generation.

Kittson

Successor of Paulson processor generation.


This section contains information about scheduled or expected future computer chips. It may contain preliminary or speculative information, and may not reflect the final specification of the product.