January 9, 2008 - Today, Nextreme introduces a new micro cooling element. The Ultra-High Packing Fraction (UPF) OptoCooler module is based on the Thermal Copper Pillar Bump technology, effectively integrating a Peltier cooler into the flip-chip bumps.
The OptoCooler module is based on Nextreme's Thermal Copper Pillar Bump process (TCPB), effectively integrating a Peltier cooler (a thermo-electric heat pump, TEC) into the interconnecting copper/solder bumps of the flip-chip package.
According to Nextreme, system level cooling solutions using heat sinks, fans, water cooling and even refrigeration will not be able to ultimately solve the heat, power and cooling requirements of future chips. By replacing the current Copper Pillar Bumps (CPBs) by thermally active bumps, the current mechanical and electrical functionality is complemented with cooling, temperature control and even power generation, making thermal and power management an integrated circuit element.
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