The ChipList, by Adrian Offerman; The Processor Portal

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Intel Core 2 Duo T5xxx/T7xxx series mobile processor (Merom 2M, Socket P)

Identification


Model name: Core 2 Duo T5xxx/T7xxx series.
Code name: Merom 2M, Socket P.
Supplier: Intel.
Component class: CPU.

Generation


Generation: Core 2.

Compatibility


Dual-core technology.

64 bit technology: EM64T.

Multimedia instruction sets: MMX, SSE, SSE2, SSE3, SSSE3.

Cache


L1 cache: (2x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Shared L2 cache: 2 Mbyte.

Architecture


100-166/200 MHz QDR bus (Dynamic Front-Side Bus Frequency Switching).

Memory protection: XD bit.

Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).

T7xxx series: Virtualization Technology (VT, Vanderpool).

Multi-processing


Dual-core technology.

Multiplier


Power management


Power management: Enhanced Intel SpeedStep Technology (EIST).

Clock speed


Clock speed Model Multiplier Voltage Introduction Order part numbers
166/1500 MHz Intel Core 2 Duo T5250 1 2 CPU 9 1.0375-1.3000 V Q2 2007 OEM (PGA): LF80537GF0212M
200/1400 MHz Intel Core 2 Duo T5270 1 2 CPU 7 1.0375-1.3000 V October 2007  
166/1667 MHz Intel Core 2 Duo T5450 1 2 CPU 10 1.0375-1.3000 V Q2 2007 OEM (PGA): LF80537 T5450
200/1600 MHz Intel Core 2 Duo T5470 1 2 CPU 8 1.0375-1.3000 V July 2007 OEM (PGA): LF80537 T5470
166/1833 MHz Intel Core 2 Duo T5550 1 2 CPU 11 1.075-1.175 V January 2008 OEM (PGA): LF80537GF0342MT
166/2000 MHz Intel Core 2 Duo T5750 1 2 CPU 12 1.0375-1.3000 V January 2008  
166/2167 MHz Intel Core 2 Duo T5850 1 2 CPU 13   March 2008  
200/1800 MHz Intel Core 2 Duo T7100 CPU 9 1.075-1.175 V May 2007 OEM (BGA): LE80537GG0332M,
OEM (PGA): LF80537GG0332M,
PIB (PGA): BX80537T7100
Clock speed Model Multiplier Voltage Introduction Order part numbers
200/2000 MHz Intel Core 2 Duo T7250 CPU 10 1.075-1.175 V September 2007 OEM (BGA): LE80537GG0412M,
OEM (PGA): LF80537GG0412M,
PIB (PGA): BX80537T7250

  1. no Virtualization Technology (VT)
  2. OEM only

Physics


Power dissipation: 35 W TDP.

Temperature: 0-100 °C.

Manufacturing process: 65 nm (P1264).

Number of transistors: 167 million.

Die size: 111 mm2.

Packaging: Socket P.

System management


Remote management: Intel Active Management (iAMT2).

CPUID32


Type Family Model Stepping Description
0x0 0x6 0xF 0xD stepping M0

Step level


Text:

Step levels: M0.

S-Spec / Stepping code


Model Code Stepping Description
Intel Core 2 Duo T7250 CPU SLA3T M0 FCBGA6/Micro-FCBGA
Intel Core 2 Duo T7100 CPU SLA3U M0 FCBGA6/Micro-FCBGA
Intel Core 2 Duo T7250 CPU SLA49 M0 Socket P (FCPGA6/Micro-FCPGA)
Intel Core 2 Duo T7100 CPU SLA4A M0 Socket P (FCPGA6/Micro-FCPGA)
Intel Core 2 Duo T5750 CPU   M0 Socket P (FCPGA6/Micro-FCPGA)
Intel Core 2 Duo T5550 CPU SLA4E M0 Socket P (FCPGA6/Micro-FCPGA)
Intel Core 2 Duo T5450 CPU SLA4F M0 Socket P (FCPGA6/Micro-FCPGA)
Intel Core 2 Duo T5250 CPU SLA9S M0 Socket P (FCPGA6/Micro-FCPGA)
Model Code Stepping Description
Intel Core 2 Duo T5470 CPU SLAEB M0 Socket P (FCPGA6/Micro-FCPGA)
Intel Core 2 Duo T5270 CPU   M0 Socket P (FCPGA6/Micro-FCPGA)

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