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19.11.3  Intel Core 2 Quad Q9xxx/Q8xxx series processor (Yorkfield-6M)

Identification


Model name: Core 2 Quad Q9xxx/Q8xxx series.
Code name: Yorkfield-6M.
Supplier: Intel.
Component class: CPU.

Generation


Generation: Core 2.

Compatibility


Quad-core technology.

64 bit technology: EM64T.

Multimedia instruction sets: MMX, SSE, SSE2, SSE3. SSSE3, SSE4.1.

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 3 Mbyte, 12-way set-associative.

Architecture


333 MHz QDR Front-Side Bus (FSB).

Memory protection: XD bit.

Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).

Virtualization Technology (VT, Vanderpool).

Multi-processing


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

Multiplier


Power management


Power management:

  • Enhanced Intel SpeedStep Technology (EIST),
  • Enhanced Halt State (C1E),
  • Extended Stop Grant State (C2E),
  • Deep Sleep State (C3E),
  • Deeper Sleep State (C4E),
  • from stepping E0: ACNT2,
  • from stepping E0: Power Status Indicator (PSI).

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Marking Order part numbers
333/2500 MHz Intel Core 2 Quad Q9300 CPU 7.5 95 W TDP March 2008 PCG: 05A OEM (stepping M0, M1): EU80580PJ0606M,
PIB: BX80580Q9300,
PIB (for China): BXC80580Q9300
333/2667 MHz Intel Core 2 Quad Q9400 CPU 8 95 W TDP August 2008 PCG: 05A OEM (stepping R0, halide-free): AT80580PJ0676M,
PIB: BX80580Q9400,
PIB (for China): BXC80580Q9400
333/2667 MHz Intel Core 2 Quad Q9400S CPU 8 65 W TDP January 2009 PCG: 06 OEM (stepping R0, halide-free): AT80580AJ0676M,
PIB: BX80580Q9400S

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 2 Mbyte (other (2x) 1 Mbyte disfunctional/disabled), 12-way set-associative.

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Marking Order part numbers
333/2333 MHz Intel Core 2 Quad Q8200 CPU 7 95 W TDP August 2008 PCG: 05A OEM (stepping M1): EU80580PJ0534MN,
OEM (stepping R0, halide-free): AT80580PJ0534MN,
PIB: BX80580Q8200,
PIB (for China): BXC80580Q8200
333/2333 MHz Intel Core 2 Quad Q8200S CPU 7 65 W TDP January 2009 PCG: 06 OEM (stepping R0, halide-free): AT80580AJ0534MN,
PIB: BX80580Q8200S
333/2500 MHz Intel Core 2 Quad Q8300 CPU 7.5 95 W TDP November 2008 PCG: 05A OEM (stepping R0, halide-free): AT80580PJ0604MN,
PIB: BX80580Q8300,
PIB (for China): BXC80580Q8300

Physics


Voltage: 0.8500-1.3625 V (0.962-1.225 V).
Power dissipation: 95/65 W TDP.

Temperature:

  • 95 W TDP: 5-71.4 °C,
  • 65 W TDP: 5-76.3 °C.

Manufacturing process: 45 nm (P1266).

Die size: (2x) 82 mm2.

Packaging: Socket T / LGA 775.

Thermal management


Thermal management:

  • Platform Environment Control Interface (PECI),
  • PROCHOT# (Thermal Control Circuit, TCC),
  • THERMTRIP#.

System management


Remote management: Intel Active Management (iAMT2).

CPUID32


Extended family Extended model Type Family Model Stepping Description
    0x0 0x6 0x7 0x4 stepping B1
0x0 0x1 0x0 0x6 0x7 0x6 stepping M0
0x0 0x1 0x0 0x6 0x7 0x7 stepping M1
0x0 0x1 0x0 0x6 0x7 0xA stepping R0

Step level


Text:

Step levels:

  • B1,
  • M0,
  • M1,
  • R0.

S-Spec / Stepping code


Model Code Stepping Description
Intel Core 2 Quad Q9300 CPU QAKY B1 ES  
Intel Core 2 Quad Q9300 CPU SLAMX M0 no C2E, C3E, C4E
Intel Core 2 Quad Q9300 CPU SLAWE M1 no C2E, C3E, C4E
Intel Core 2 Quad Q8200 CPU SLB5M M1 no C2E, C3E, C4E
Intel Core 2 Quad Q8300 CPU QHJC R0 sample  
Intel Core 2 Quad Q8300 CPU SLB5W R0  
Intel Core 2 Quad Q9400 CPU QHHU R0 ES  
Intel Core 2 Quad Q9400 CPU SLB6B R0  
Model Code Stepping Description
Intel Core 2 Quad Q8200 CPU SLG9S R0 no C2E
Intel Core 2 Quad Q8200S CPU SLG9T R0 no C2E
Intel Core 2 Quad Q9400S CPU SLG9U R0 no C2E

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