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19.13.1  Intel Core 2 Quad Xeon DP E53xx/X53xx series processor (Cloverton)

Identification


Model name: Core 2 Quad Xeon DP E53xx/X53xx series.
Code name: Cloverton.
Supplier: Intel.
Component class: CPU.

Generation


Generation: Core 2.

Compatibility


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

64 bit technology: EM64T.

Multimedia instruction sets: MMX, SSE, SSE2, SSE3, SSSE3.

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 4 Mbyte.

Architecture


266/333 MHz QDR bus.

Memory protection: XD bit.

Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).

Virtualization Technology (VT, Vanderpool).

Multi-processing


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

Symmetric Multi-Processing (SMP): max. 2-way.

Multiplier


Power management


Power management: Enhanced Intel SpeedStep Technology (EIST).

Clock speed


Clock speed Model Multiplier Voltage Power dissipation Introduction Order part numbers
266/1600 MHz Intel Core 2 Quad-Core Xeon DP E5310 CPU 6 1.0-1.5 V 80 W TDP November 2006 OEM: HH80563QH0258M,
PIB (active): BX80563E5310A,
PIB (passive): BX80563E5310P
266/1866 MHz Intel Core 2 Quad-Core Xeon DP E5320 CPU 7 1.0-1.5 V 80 W TDP November 2006 OEM: HH80563QH0368M,
PIB (active): BX80563E5320A,
PIB (passive): BX80563E5320P
333/2000 MHz Intel Core 2 Quad-Core Xeon DP E5335 CPU 6 1.0-1.5 V 80 W TDP December 2006 OEM: HH80563QJ0418M
333/2333 MHz Intel Core 2 Quad-Core Xeon DP E5345 CPU 7 1.162-1.200 V 80 W TDP November 2006 OEM: HH80563QJ0538M,
PIB (active): BX80563E5345A,
PIB (passive): BX80563E5345P
333/2667 MHz Intel Core 2 Quad-Core Xeon DP X5355 CPU 8 1.162-1.200 V 120 W TDP November 2006 OEM: HH80563KJ0678M,
PIB (active): BX80563X5355A,
PIB (passive): BX80563X5355P
333/3000 MHz Intel Core 2 Quad-Core Xeon DP X5365 CPU 9   120 W TDP August 2007  

Physics


Manufacturing process: 65 nm (P1264).

Number of transistors: (2x) 291 million.

Die size: (2x) 143 mm2.

Packaging: Socket J / LGA 771.

System management


Remote management: Intel Active Management (iAMT2).

Step level


Text:

Step levels: B3.

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