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15.2.4  AMD Sempron processor (Palermo, revision E3, Socket 754)

Identification


Model name: Sempron.
Code name: Palermo, revision E3.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.40 GHz AMD Sempron 2500+ 1 CPU 256 kbyte L2 7 April 2005 OEM: SDA2500AIO3BO,
PIB: SDA2500BOBOX
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 April 2005 OEM: SDA2600AIO2BO,
PIB: SDA2600BOBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 April 2005 OEM: SDA2800AIO3BO,
PIB: SDA2800BOBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 April 2005 OEM: SDA3000AIO2BO,
PIB: SDA3000BOBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 April 2005 OEM: SDA3100AIO3BO,
PIB: SDA3100BOBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 April 2005 OEM: SDA3300AIO2BO,
PIB: SDA3300BOBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E3.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3000+ CPU CBBLE E3
AMD Sempron 3300+ CPU LBBLY E3
AMD Sempron 2600+, 3000+, 3300+ CPU QBBLE E3

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