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15.5  AMD Mobile Sempron processor


15.5.1  AMD Mobile Sempron processor (Dublin, revision CG, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Dublin, revision CG, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BIX2AY
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BIX3AY
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BIX2AY

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 13-62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3000+ CPU CCAUC CG

15.5.2  AMD Mobile Sempron processor (Dublin, revision CG, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Dublin, revision CG, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMS2600BOX2LA
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMS2800BOX3LA

Physics


Voltage: 0.975-1.25 V.
Power dissipation: 9-25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+ CPU ACAUC CG
AMD Mobile Sempron 2800+ CPU CCAUC CG

15.5.3  AMD Mobile Sempron processor (Georgetown, revision D0, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Georgetown, revision D0, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BIX2BA
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BIX3BA
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BIX2BA
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 May 2005 OEM: SMN3100BIX3BA
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 August 2005 OEM: SMN3300BIX2BA

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 3000+, 3100+ CPU CBBFD D0
AMD Mobile Sempron 3100+ CPU CBBHD D0

15.5.4  AMD Mobile Sempron processor (Sonora, revision D0, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Sonora, revision D0, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMS2600BOX2LB
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMS2800BOX3LB
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 November 2004 OEM: SMS3000BOX2LB
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 January 2005 OEM: SMS3100BOX3LB

Physics


Voltage: 0.975-1.250 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3100+ CPU ABBGD D0
AMD Mobile Sempron 3000+ CPU CBBFD D0
AMD Mobile Sempron 2600+ CPU CBBHD D0
AMD Mobile Sempron 2800+ CPU CBBID D0
AMD Mobile Sempron 2800+, 3100+ CPU LBBID D0

15.5.5  AMD Mobile Sempron processor (Albany, revision E6, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Albany, revision E6, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2005 OEM: SMN3000BIX2BX
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 July 2005 OEM: SMN3100BIX3BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 July 2005 OEM: SMN3300BIX2BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 10 January 2006 OEM: SMN3400BIX3BX
200 MHz / 2.20 GHz AMD Mobile Sempron 3600+ CPU 128 kbyte L2 11 May 2006 OEM: SMN3600BIX2BX

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BKX2BX
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BKX3BX
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BKX2BX
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9   OEM: SMN3100BKX3BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10   OEM: SMN3300BKX2BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 10   OEM: SMN3400BKX3BX
200 MHz / 2.20 GHz AMD Mobile Sempron 3600+ CPU 128 kbyte L2 11   OEM: SMN3600BKX2BX

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 3000+ CPU ABBWE E6 (BKX interfix)

15.5.6  AMD Mobile Sempron processor (Roma, revision E6, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Roma, revision E6, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8   OEM: SMS2600BQX2LF
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2005 OEM: SMS2800BQX3LF
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2005 OEM: SMS3000BQX2LE,
OEM: SMS3000BQX2LF
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 July 2005 OEM: SMS3100BQX3LE,
OEM: SMS3100BQX3LF
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 July 2005 OEM: SMS3300BQX2LE,
OEM: SMS3300BQX2LF
200 MHz / 2.00 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 10 May 2006 OEM: SMS3400BQX3LE,
OEM: SMS3400BQX3LF

Physics


Voltage: 0.95-1.20 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 2800+, 3300+ CPU ABBWE E6
AMD Mobile Sempron 2800+, 3000+, 3300+, 3400+ CPU CBBWE E6
AMD Mobile Sempron 3400+ CPU CCBWE E6

15.5.7  AMD Mobile Sempron processor (Keene, revision F2, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Keene, revision F2, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 3200+ CPU 512 kbyte L2 8 May 2006 OEM: SMS3200HAX4CM
200 MHz / 1.80 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SMS3400HAX3CM
200 MHz / 1.80 GHz AMD Mobile Sempron 3500+ CPU 512 kbyte L2 9 May 2006 OEM: SMS3500HAX4CM
200 MHz / 2.00 GHz AMD Mobile Sempron 3600+ CPU 256 kbyte L2 10 October 2006 OEM: SMS3600HAX3CM

Physics


Voltage: 0.950-1.125 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket S1.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3200+, 3600+ CPU LBBVF F2
AMD Mobile Sempron 3400+ CPU LEBAF F2

15.5.8  AMD Mobile Sempron processor (Sherman, revision G, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Sherman, revision G, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Voltage Power dissipation Introduction Order part numbers
200 MHz / 1.00 GHz AMD Mobile Sempron 2100+ fanless embedded CPU 256 kbyte L2 5 0.950-1.125 V 8 W TDP May 2007 OEM (stepping G1): SMF2100HAX3DQE
200 MHz / 2.00 GHz AMD Mobile Sempron 3600+ CPU 256 kbyte L2 10 1.125-1.200 V 25 W TDP   OEM (stepping G2): SMS3600HAX3DN
200 MHz / 2.00 GHz AMD Mobile Sempron 3700+ embedded CPU 512 kbyte L2 10 1.125-1.200 V 25 W TDP   OEM (stepping G1): SMS3700HAX4DQE
200 MHz / 2.20 GHz AMD Mobile Sempron 3800+ CPU 256 kbyte L2 11 1.125-1.200 V 31 W TDP   OEM (stepping G2): SMD3800HAX3DN
200 MHz / 2.20 GHz AMD Mobile Sempron 4000+ CPU 512 kbyte L2 11 1.125-1.200 V 31 W TDP   OEM (stepping G2): SMD4000HAX4DN

Physics


Temperature: max. 95 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3600+, 4000+ CPU AAA8G G2

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