The ChipList, by Adrian Offerman; The Processor Portal

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15.2  AMD Sempron 64 processor


15.2.1  AMD Sempron processor (Paris, revision CG)

Identification


Model name: Sempron.
Code name: Paris, revision CG.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 February 2005 OEM: SDA3000AIP2AX,
PIB: SDA3000AXBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 July 2004 OEM: SDA3100AIP3AX,
PIB: SDA3100AXBOX

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.2.2  AMD Sempron processor (Winchester, revision D0)

Identification


Model name: Sempron.
Code name: Winchester, revision D0.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 October 2005 OEM: SDA3000DIO2BI,
OEM: SDA3000DIO2BA
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 256 kbyte L2 9 October 2005 OEM: SDA3200DIO3BI

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3200+ CPU ABBGD D0
AMD Sempron 3000+, 3200+ CPU LBBIX D0

15.2.3  AMD Sempron processor (Palermo, revision D0)

Identification


Model name: Sempron.
Code name: Palermo, revision D0.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64 (only supported by model numbers ending in CV).

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 August 2004 OEM: SDA2600AIO2BA,
OEM (AMD64): SDA2600AIO2CV,
PIB (no AMD64): SDA2600BABOX,
PIB (AMD64): SDA2600CVBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 August 2004 OEM: SDA2800AIO3BA,
OEM (AMD64): SDA2800AIO3CV,
PIB (no AMD64): SDA2800BABOX,
PIB (AMD64): SDA2800CVBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 April 2005 OEM: SDA3000AIO2BA,
OEM (AMD64): SDA3000AIO2CV,
PIB (no AMD64): SDA3000BABOX,
PIB (AMD64): SDA3000CVBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 April 2005 OEM: SDA3100AIO3BA,
OEM (AMD64): SDA3100AIO3CV,
PIB (no AMD64): SDA3100BABOX,
PIB (AMD64): SDA3100CVBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 April 2005 OEM: SDA3300AIO2BA,
OEM (AMD64): SDA3300AIO2CV,
PIB (no AMD64): SDA3300BABOX,
PIB (AMD64): SDA3300CVBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2800+, 3300+ CPU ABBHD D0
AMD Sempron 2600+ CPU CBBHD D0
AMD Sempron 2600+, 2800+ CPU CBBID D0
AMD Sempron 2600+, 3000+ CPU LBBID D0
AMD Sempron 2600+, 2800+, 3100+ CPU LBBIX D0

15.2.4  AMD Sempron processor (Palermo, revision E3, Socket 754)

Identification


Model name: Sempron.
Code name: Palermo, revision E3.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.40 GHz AMD Sempron 2500+ 1 CPU 256 kbyte L2 7 April 2005 OEM: SDA2500AIO3BO,
PIB: SDA2500BOBOX
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 April 2005 OEM: SDA2600AIO2BO,
PIB: SDA2600BOBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 April 2005 OEM: SDA2800AIO3BO,
PIB: SDA2800BOBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 April 2005 OEM: SDA3000AIO2BO,
PIB: SDA3000BOBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 April 2005 OEM: SDA3100AIO3BO,
PIB: SDA3100BOBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 April 2005 OEM: SDA3300AIO2BO,
PIB: SDA3300BOBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E3.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3000+ CPU CBBLE E3
AMD Sempron 3300+ CPU LBBLY E3
AMD Sempron 2600+, 3000+, 3300+ CPU QBBLE E3

15.2.5  AMD Sempron processor (Palermo, revision E6, Socket 754)

Identification


Model name: Sempron.
Code name: Palermo, revision E6.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.40 GHz AMD Sempron 2500+ 1 CPU 256 kbyte L2 7 July 2005 OEM: SDA2500AIO3BX,
PIB: SDA2500BXBOX
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 August 2005 OEM: SDA2600AIO2BX,
PIB: SDA2600BXBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 July 2005 OEM: SDA2800AIO3BX,
PIB: SDA2800BXBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 July 2005 OEM: SDA3000AIO2BX,
PIB: SDA3000BXBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 July 2005 OEM: SDA3100AIO3BX,
PIB: SDA3100BXBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 July 2005 OEM: SDA3300AIO2BX,
PIB: SDA3300BXBOX
200 MHz / 2.00 GHz AMD Sempron 3400+ CPU 256 kbyte L2 10 August 2005 OEM: SDA3400AIO3BX,
PIB: SDA3400BXBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2500+, 2600+, 2800+, 3000+, 3100+, 3300+, 3400+ CPU ABBWE E6
AMD Sempron 2500+, 2600+, 2800+, 3000+, 3100+, 3300+, 3400+ CPU LBBWE E6
AMD Sempron 2500+, 2800+, 3000+ CPU LEBBE E6
AMD Sempron 2800+ CPU LEBCE E6
AMD Sempron 3000+ CPU LEBDE E6
AMD Sempron 2800+, 3000+ CPU LFBAE E6
AMD Sempron 3000+ CPU LFBBE E6
AMD Sempron 2500+, 2600+, 2800+, 3000+ CPU NBBWE E6

15.2.6  AMD Sempron processor (Palermo, revision E3, Socket 939)

Identification


Model name: Sempron.
Code name: Palermo, revision E3.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 October 2005 OEM: SDA3000DIO2BP
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 256 kbyte L2 9 October 2005 OEM: SDA3200DIO3BP

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E3.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3200+ CPU ABBGD E3
AMD Sempron 3000+, 3200+ CPU CBBLE E3
AMD Sempron 3000+ CPU LBBLY E3

15.2.7  AMD Sempron processor (Palermo, revision E6, Socket 939)

Identification


Model name: Sempron.
Code name: Palermo, revision E6.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 October 2005 OEM: SDA3000DIO2BW
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 256 kbyte L2 9 October 2005 OEM: SDA3200DIO3BW
200 MHz / 2.00 GHz AMD Sempron 3400+ CPU 128 kbyte L2 10 October 2005 OEM: SDA3400DIO2BW
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 256 kbyte L2 10 October 2005 OEM: SDA3500DIO2BW

AMD Sempron processor (Processor-In-a-Box). [AMD]

AMD Sempron processor

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3000+, 3200+, 3500+ CPU ABBWE E6
AMD Sempron 3200+, 3500+ CPU LBBWE E6
AMD Sempron 3200+ CPU NBBWE E6

15.2.8  AMD Sempron processor (Manila, revision F)

Identification


Model name: Sempron.
Code name: Manila, revision F.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Sempron processor (front). [AMD]

AMD Sempron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

AMD Sempron processor (front and back). [AMD]

AMD Sempron processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 128 kbyte L2 8 May 2006 OEM: SDA2800IAA2CN,
PIB: SDA2800CNBOX
200 MHz / 1.60 GHz AMD Sempron 3000+ 1 CPU 256 kbyte L2 8 May 2006 OEM: SDA3000IAA3CN,
PIB: SDA3000CNBOX
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 128 kbyte L2 9 May 2006 OEM: SDA3200IAA2CN,
OEM: SDA3200IAA2CW,
PIB: SDA3200CNBOX,
PIB: SDA3200CWBOX,
WOF: SDA3200CWWOF
200 MHz / 1.80 GHz AMD Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SDA3400IAA3CN,
OEM: SDA3400IAA3CW,
PIB: SDA3400CNBOX,
PIB: SDA3400CWBOX
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 128 kbyte L2 10 May 2006 OEM: SDA3500IAA2CN,
OEM: SDA3500IAA2CW,
PIB: SDA3500CNBOX
200 MHz / 2.00 GHz AMD Sempron 3600+ CPU 256 kbyte L2 10 May 2006 OEM: SDA3600IAA3CN,
OEM: SDA3600IAA3CW,
PIB: SDA3600CNBOX,
PIB: SDA3600CWBOX
200 MHz / 2.20 GHz AMD Sempron 3800+ CPU 256 kbyte L2 11 October 2006 OEM: SDA3800IAA3CN,
PIB: SDA3800CNBOX

  1. no Cool'n'Quiet (CnQ) power management

AMD Sempron processor (Socket AM2, Processor-In-a-Box). [AMD]

AMD Sempron processor

Physics


Voltage: 1.25-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 55-69 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2800+, 3000+, 3400+ CPU LBBVF F2
AMD Sempron 3200+ CPU LEDBF F2
AMD Sempron 2800+, 3000+ CPU LFBCF F2
AMD Sempron 3000+, 3500+ CPU NBBVF F2

15.2.9  AMD Sempron processor (Manila, revision F, Energy Efficient Small Form Factor)

Identification


Model name: Sempron.
Code name: Manila, revision F, Energy Efficient Small Form Factor.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

AMD Sempron processor (front and back). [AMD]

AMD Sempron processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 3000+ 1 CPU 256 kbyte L2 8 May 2006 OEM: SDD3000IAA3CN,
PIB: SDD3000CNBOX
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 128 kbyte L2 9 May 2006 OEM: SDD3200IAA2CN,
PIB: SDD3200CNBOX
200 MHz / 1.80 GHz AMD Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SDD3400IAA3CN,
PIB: SDD3400CBNOX
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 128 kbyte L2 10 May 2006 OEM: SDD3500IAA2CN,
PIB: SDD3500CBNOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.20/1.25 V.
Power dissipation: 35 W TDP.

Temperature: max. 55-78 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3400+ CPU LBBVF F2

15.2.10  AMD Sempron processor (Sparta, revision G, Energy Efficient)

Identification


Model name: Sempron.
Code name: Sparta, revision G, Energy Efficient.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Voltage Temperature Introduction Order part numbers
200 MHz / 1.9 GHz AMD Sempron LE-1100 CPU 256 kbyte L2 9.5 1.25-1.35 V max. 55-65 °C October 2007 OEM (stepping G1): SDH1100IAA3DE,
PIB (stepping G1): SDH1100DEBOX,
PIB (stepping G1): SDH1100DPBOX
200 MHz / 2.0 GHz AMD Sempron LE-1150 CPU 256 kbyte L2 10 1.25-1.35 V max. 61-75 °C August 2007 OEM (stepping G1): SDH1150IAA3DE,
PIB (stepping G1): SDH1150DEBOX,
PIB (stepping G1): SDH1150DPBOX
200 MHz / 2.1 GHz AMD Sempron LE-1200 CPU 512 kbyte L2 10.5 1.20-1.40 V max. 65 °C   OEM (stepping G1): SDH1200IAA4DE,
PIB (stepping G1): SDH1200DEBOX
200 MHz / 2.1 GHz AMD Sempron LE-1200 CPU 512 kbyte L2 10.5 1.20-1.40 V   October 2007 OEM (stepping G2): SDH1200IAA4DP,
PIB (stepping G2): SDH1200DPBOX
200 MHz / 2.2 GHz AMD Sempron LE-1250 CPU 512 kbyte L2 11 1.20-1.40 V max. 75 °C October 2007 OEM (stepping G2): SDH1250IAA4DP,
PIB (stepping G2): SDH1250DPBOX
200 MHz / 2.3 GHz AMD Sempron LE-1300 CPU 512 kbyte L2 11.5 1.20-1.40 V max. 75 °C January 2008 OEM (stepping G2): SDH1300IAA4DP,
PIB (stepping G2): SDH1300DPBOX

Physics


Power dissipation: 45 W TDP.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

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