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20  AMD K10 processors

20.1  AMD Phenom X4 Quad-Core processor


20.1.1  AMD Phenom X4 9xxx series Quad-Core processor (Agena, stepping B2)

Identification


Model name: Phenom X4 9xxx series Quad-Core.
Code name: Agena, stepping B2.
Family name: Stars.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (4x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (4x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 266/533/1066 MHz, Unbuffered DDR2-1066 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 1 Gbyte = 8 Gbyte (4 x 2 Gbyte double-sided PC2-8500 memory module) per processor.

1.8 GHz HyperTransport 3.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Quad-core technology: four cores connected through Internal System Request Queue Crossbar.

Multiplier


Power management


Power management: Cool'n'Quiet 2.0, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Phenom X4 9100e Quad-Core 1 CPU 9 March 2008 OEM: HD9100OBJ4BGD
200/2200 MHz AMD Phenom X4 9500 Quad-Core CPU 11 November 2007 OEM: HD9500WCJ4BGD,
PIB: HD9500WCGDBOX
200/2300 MHz AMD Phenom X4 9600 Quad-Core CPU 11.5 November 2007 OEM: HD9600WCJ4BGD,
PIB: HD9600WCGDBOX
200/2300 MHz AMD Phenom X4 9600 Black Edition Quad-Core 2 CPU 11.5 (unlocked) November 2007 OEM: HD960ZWCJ4BGD,
PIB: HD960ZWCGDBOX

  1. 1.6 GHz HyperTransport bus; power dissipation: 65 W TDP; temperature: max. 61 °C
  2. unlocked multiplier

Physics


Voltage: 1.10-1.25 V.
Power dissipation: 95 W TDP

Temperature: max. 70 °C.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket AM2+.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • B2: production.

20.1.2  AMD Phenom X4 9xxx series Quad-Core processor (Agena, stepping B3)

Identification


Model name: Phenom X4 9xxx series Quad-Core.
Code name: Agena, stepping B3.
Family name: Stars.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (4x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (4x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 266/533/1066 MHz, Unbuffered DDR2-1066 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 1 Gbyte = 8 Gbyte (4 x 2 Gbyte double-sided PC2-8500 memory module) per processor.

1.8 GHz HyperTransport 3.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Quad-core technology: four cores connected through Internal System Request Queue Crossbar.

Multiplier


Power management


Power management: Cool'n'Quiet 2.0, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Voltage Power dissipation Temperature Introduction Order part numbers
200/2200 MHz AMD Phenom X4 9550 Quad-Core CPU 11 1.10-1.25 V 95 W TDP max. 70 °C March 2008 OEM: HD9550WCJ4BGH,
PIB: HD9550WCGHBOX
200/2300 MHz AMD Phenom X4 9600B Quad-Core 1 CPU 11.5 1.10-1.25 V 95 W TDP max. 70 °C April 2008 OEM: HD960BWCJ4BGH
200/2300 MHz AMD Phenom X4 9650 Quad-Core CPU 11.5 1.10-1.25 V 95 W TDP max. 70 °C March 2008 OEM: HD9650WCJ4BGH,
PIB: HD9650WCGHBOX
200/2400 MHz AMD Phenom X4 9750 Quad-Core CPU 12 1.20-1.30 V 125 W TDP max. 61 °C March 2008 OEM: HD9750XAJ4BGH,
PIB: HD9750XAGHBOX
200/2500 MHz AMD Phenom X4 9850 Black Edition Quad-Core 2 CPU 12.5 (unlocked) 1.20-1.30 V 125 W TDP max. 61 °C March 2008 OEM: HD985ZXAJ4BGH,
PIB: HD985ZXGHBOX

  1. Business Class: availability guaranteed for 24 months after release
  2. 2.0 GHz HyperTransport bus; unlocked multiplier

Physics


Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket AM2+.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • B3: full production.

20.2  AMD Phenom X3 Triple-Core processor


20.2.1  AMD Phenom X3 8xxx series Triple-Core processor (Toliman, stepping B2)

Identification


Model name: Phenom X3 8xxx series Triple-Core.
Code name: Toliman, stepping B2.
Family name: Stars.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (3x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (3x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 266/533/1066 MHz, Unbuffered DDR2-1066 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 1 Gbyte = 8 Gbyte (4 x 2 Gbyte double-sided PC2-8500 memory module) per processor.

1.8 GHz HyperTransport 3.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Triple-core technology: three cores connected through Internal System Request Queue Crossbar (fourth core disfunctional/disabled).

Multiplier


Power management


Power management: Cool'n'Quiet 2.0, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2100 MHz AMD Phenom X3 8400 Triple-Core CPU 10.5 March 2008 OEM: HD8400WCJ3BGD
200/2300 MHz AMD Phenom X3 8600 Triple-Core CPU 11.5 March 2008 OEM: HD8600WCJ3BGD

Physics


Voltage: 1.10-1.25 V.
Power dissipation: 95 W TDP.

Temperature: max. 70 °C.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket AM2+.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • B2: production.

20.2.2  AMD Phenom X3 8xxx series Triple-Core processor (Toliman, stepping B3)

Identification


Model name: Phenom X3 8xxx series Triple-Core.
Code name: Toliman, stepping B3.
Family name: Stars.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (3x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (3x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 266/533/1066 MHz, Unbuffered DDR2-1066 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 1 Gbyte = 8 Gbyte (4 x 2 Gbyte double-sided PC2-8500 memory module) per processor.

1.8 GHz HyperTransport 3.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Triple-core technology: three cores connected through Internal System Request Queue Crossbar (fourth core disfunctional/disabled).

Multiplier


Power management


Power management: Cool'n'Quiet 2.0, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Voltage Introduction Order part numbers
200/2100 MHz AMD Phenom X3 8450 Triple-Core CPU 10.5 1.10-1.25 V April 2008 OEM: HD8450WCJ3BGH,
PIB: HD8450WCGHBOX
200/2300 MHz AMD Phenom X3 8600B Triple-Core 1 CPU 11.5 1.05-1.25 V April 2008 OEM: HD860BWCJ3BGD,
PIB: HD860BWCGDBOX
200/2300 MHz AMD Phenom X3 8650 Triple-Core CPU 11.5 1.10-1.25 V April 2008 OEM: HD8650WCJ3BGH,
PIB: HD8650WCGHBOX
200/2400 MHz AMD Phenom X3 8750 Triple-Core CPU 12 1.10-1.25 V April 2008 OEM: HD8750WCJ3BGH,
PIB: HD8750WCGHBOX

  1. Business Class: availability guaranteed for 24 months after release

Physics


Power dissipation: 95 W TDP.

Temperature: max. 70 °C.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket AM2+.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • B3: full production.

20.3  AMD Opteron Quad-Core processor


20.3.1  AMD Opteron 1P 1300 series Quad-Core processor (Budapest)

Identification


Model name: Opteron 1P 1300 series Quad-Core.
Code name: Budapest.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

20.3.2  AMD Opteron 1P HE 1300 series Quad-Core processor (Budapest, High Efficiency)

Identification


Model name: Opteron 1P HE 1300 series Quad-Core.
Code name: Budapest, High Efficiency.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

20.3.3  AMD Opteron 2P 2300 series Quad-Core processor (Barcelona)

Identification


Model name: Opteron 2P 2300 series Quad-Core.
Code name: Barcelona.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (4x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (4x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 166/333/667 MHz, Registered DDR2-667 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300R (ECC) memory module) per processor.

1000 MHz HyperTransport 2.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Quad-core technology: four cores connected through Internal System Request Queue Crossbar.

Multi-processor support: dual processor, connected through HyperTransport bus.

Multiplier


Power management


Power management: Enhanced PowerNow!, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Temperature Introduction Order part numbers
200/1900 MHz AMD Opteron 2347 Quad-Core CPU 9.5 max. 55-70 °C September 2007 OEM (stepping B1): OS2347WAL4BGC,
OEM (stepping BA): OS2347WAL4BGE,
WOF (stepping BA): OS2347WAL4BGEWOF
200/2000 MHz AMD Opteron 2350 Quad-Core CPU 10 max. 55-70 °C September 2007 OEM (stepping B1): OS2350WAL4BGC,
OEM (stepping BA): OS2350WAL4BGE,
WOF (stepping BA): OS2350WAL4BGEWOF,
OEM (stepping B2): OS2350WAL4BGD,
WOF (stepping B2): OS2350WAL4BGDWOF,
OEM (stepping B3): OS2350WAL4BGH,
WOF (stepping B3): OS2350WAL4BGHWOF
200/2100 MHz AMD Opteron 2352 Quad-Core CPU 10.5   April 2008 OEM (stepping BA): OS2352WAL4BGE,
OEM (stepping B2): OS2352WAL4BGD,
WOF (stepping B2): OS2352WAL4BGDWOF,
OEM (stepping B3): OS2352WAL4BGH,
WOF (stepping B3): OS2352WAL4BGHWOF
200/2200 MHz AMD Opteron 2354 Quad-Core CPU 11   April 2008 OEM (stepping B2): OS2354WAL4BGD
WOF (stepping B2): OS2352WAL4BGDWOF,
OEM (stepping B3): OS2354WAL4BGH,
WOF (stepping B3): OS2354WAL4BGHWOF
200/2300 MHz AMD Opteron 2356 Quad-Core CPU 11.5   April 2008 OEM (stepping B2): OS2356WAL4BGD,
WOF (stepping B2): OS2356WAL4BGDWOF,
OEM (stepping B3): OS2356WAL4BGH,
WOF (stepping B3): OS2356WAL4BGHWOF
200/2400 MHz AMD Opteron 2358 SE Quad-Core 1 CPU 12   June 2008 OEM (stepping B2): OS2358YAL4BGD,
OEM (stepping B3): OS2358YAL4BGH,
WOF (stepping B3): OS2358YAL4BGHWOF
200/2500 MHz AMD Opteron 2360 SE Quad-Core 1 CPU 12.5   June 2008 OEM (stepping B2): OS2360YAL4BGD,
OEM (stepping B3): OS2360YAL4BGH,
WOF (stepping B3): OS2360YAL4BGHWOF

  1. Special Edition (SE): power dissipation: 105 W ACP, 119.2 W TDP

Physics


Voltage: 1.2 V.
Power dissipation: 75 W ACP, 95 W TDP.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • A0: prototypes,
  • B0 (April 2007): speed path problems,
  • B1: first introduction,
  • BA (September 10, 2007): first production,
  • B2: production,
  • B3 (April 9, 2008): full production.

20.3.4  AMD Opteron 2P HE 2300 series Quad-Core processor (Barcelona, High Efficiency)

Identification


Model name: Opteron 2P HE 2300 series Quad-Core.
Code name: Barcelona, High Efficiency.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (4x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (4x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 166/333/667 MHz, Registered DDR2-667 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300R (ECC) memory module) per processor.

1000 MHz HyperTransport 2.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Quad-core technology: four cores connected through Internal System Request Queue Crossbar.

Multi-processor support: dual processor, connected through HyperTransport bus.

Multiplier


Power management


Power management: Enhanced PowerNow!, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1700 MHz AMD Opteron 2344 HE Quad-Core CPU 8.5 September 2007 OEM (stepping B1): OS2344PAL4BGC,
OEM (stepping BA): OS2344PAL4BGE,
OEM (stepping B3): OS2344PAL4BGH,
WOF (stepping B3): OS2344PAL4BGHWOF
200/1800 MHz AMD Opteron 2346 HE Quad-Core CPU 9 September 2007 OEM (stepping B1): OS2346PAL4BGC,
OEM (stepping BA): OS2346PAL4BGE,
WOF (stepping BA): OS2346PAL4BGEWOF,
OEM (stepping B2): OS2346PAL4BGD,
WOF (stepping B2): OS2346PAL4BGDWOF,
OEM (stepping B3): OS2346PAL4BGH,
WOF (stepping B3): OS2346PAL4BGHWOF
200/1900 MHz AMD Opteron 2347 HE Quad-Core CPU 9.5 September 2007 OEM (stepping B1): OS2347PAL4BGC,
OEM (stepping BA): OS2347PAL4BGE,
WOF (stepping BA): OS2347PAL4BGEWOF,
OEM (stepping B2): OS2347PAL4BGD,
WOF (stepping B2): OS2347PAL4BGDWOF,
OEM (stepping B3): OS2347PAL4BGH,
WOF (stepping B3): OS2347PAL4BGHWOF

Physics


Voltage: 1.15 V.
Power dissipation: 55 W ACP, 68 W TDP.

Temperature: max. 55-71 °C.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • A0: prototypes,
  • B0 (April 2007): speed path problems,
  • B1: first introduction,
  • BA (September 10, 2007): first production,
  • B2: production,
  • B3 (April 9, 2008): full production.

20.3.5  AMD Opteron 4P-8P 8300 series Quad-Core processor (Barcelona)

Identification


Model name: Opteron 4P-8P 8300 series Quad-Core.
Code name: Barcelona.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (4x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (4x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 166/333/667 MHz, Registered DDR2-667 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300R (ECC) memory module) per processor.

1000 MHz HyperTransport 2.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Quad-core technology: four cores connected through Internal System Request Queue Crossbar.

Multi-processor support: up to eight processors, connected through HyperTransport bus.

Multiplier


Power management


Power management: Enhanced PowerNow!, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Temperature Introduction Order part numbers
200/1900 MHz AMD Opteron 8347 Quad-Core CPU 9.5 max. 55-71 °C September 2007 OEM (stepping B1): OS8347WAL4BGC,
OEM (stepping BA): OS8347WAL4BGE,
OEM (stepping B3): OS8347WAL4BGH
200/2000 MHz AMD Opteron 8350 Quad-Core CPU 10 max. 55-71 °C September 2007 OEM (stepping B1): OS8350WAL4BGC,
OEM (stepping BA): OS8350WAL4BGE,
WOF (stepping BA): OS8350WAL4BGEWOF,
OEM (stepping B2): OS8350WAL4BGD,
WOF (stepping B2): OS8350WAL4BGDWOF,
OEM (stepping B3): OS8350WAL4BGH,
WOF (stepping B3): OS8350WAL4BGHWOF
200/2200 MHz AMD Opteron 8354 Quad-Core CPU 11   April 2008 OEM (stepping B2): OS8354WAL4BGD,
WOF (stepping B2): OS8354WAL4BGDWOF,
OEM (stepping B3): OS8354WAL4BGH,
WOF (stepping B3): OS8354WAL4BGHWOF
200/2300 MHz AMD Opteron 8356 Quad-Core CPU 11.5   April 2008 OEM (stepping B2): OS8356WAL4BGD,
WOF (stepping B2): OS8356WAL4BGDWOF,
OEM (stepping B3): OS8356WAL4BGH,
WOF (stepping B3): OS8356WAL4BGHWOF
200/2400 MHz AMD Opteron 8358 SE Quad-Core 1 CPU 12   June 2008 OEM (stepping B2): OS8358YAL4BGD,
OEM (stepping B3): OS8358YAL4BGH,
WOF (stepping B3): OS8358YAL4BGHWOF
200/2500 MHz AMD Opteron 8360 SE Quad-Core 1 CPU 12.5   June 2008 OEM (stepping B2): OS8360YAL4BGD,
OEM (stepping B3): OS8360YAL4BGH,
WOF (stepping B3): OS8360YAL4BGHWOF

  1. Special Edition (SE): power dissipation: 105 W ACP, 119.2 W TDP

Physics


Voltage: 1.2 V.
Power dissipation: 75 W ACP, 95 W TDP

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • A0: prototypes,
  • B0 (April 2007): speed path problems,
  • B1: first introduction,
  • BA (September 10, 2007): first production,
  • B2: production,
  • B3 (April 9, 2008): full production.

20.3.6  AMD Opteron 4P-8P HE 8300 series Quad-Core processor (Barcelona, High Efficiency)

Identification


Model name: Opteron 4P-8P HE 8300 series Quad-Core.
Code name: Barcelona, High Efficiency.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (4x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (4x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 166/333/667 MHz, Registered DDR2-667 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300R (ECC) memory module) per processor.

1000 MHz HyperTransport 2.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Quad-core technology: four cores connected through Internal System Request Queue Crossbar.

Multi-processor support: up to eight processors, connected through HyperTransport bus.

Multiplier


Power management


Power management: Enhanced PowerNow!, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 8346 HE Quad-Core CPU 9 September 2007 OEM (stepping BA): OS8346PAL4BGE,
OEM (stepping B2): OS8346PAL4BGD,
OEM (stepping B3): OS8346PAL4BGH
200/1900 MHz AMD Opteron 8347 HE Quad-Core CPU 9.5 September 2007 OEM (stepping BA): OS8347PAL4BGE,
OEM (stepping B2): OS8347PAL4BGD,
OEM (stepping B3): OS8347PAL4BGH

Physics


Voltage: 1.15 V.
Power dissipation: 55 W ACP, 68 W TDP

Temperature: max. 55-71 °C.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • A0: prototypes,
  • B0 (April 2007): speed path problems,
  • B1: first introduction,
  • BA (September 10, 2007): first production,
  • B2: production,
  • B3 (April 9, 2008): full production.

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