The ChipList, by Adrian Offerman; The Processor Portal

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17  AMD Athlon 64 X2 Dual-Core processors

Overview


AMD Athlon 64 X2 processor overview Athlon 64 X2 Dual-Core Athlon 64 X2 Manchester, Rev. E4 Athlon 64 Manchester, Rev. E4, Single Core Toledo, Rev. E6 Windsor 2MB, Rev. F Windsor 2MB, Rev. F, Energy Efficient Windsor 1MB, Rev. F Windsor 1MB, Rev. F, Energy Efficient Windsor 1MB, Rev. F, Energy Efficient Small Form Factor Brisbane, Rev. G, Energy Efficient Turion 64 X2 Trinidad, Rev. F Taylor, Rev. F Tyler, Rev. G Athlon 64 FX Toledo, Rev. E6 Windsor 2MB, Rev. F Windsor 2MB, Rev. F; 4x4, QuadFather Opteron 64 Dual-Core Denmark, Rev. E Italy, Rev. E Italy, Rev. E, High Efficiency Egypt, Rev. E Egypt, Rev. E, High Efficiency Santa Ana, Rev. F Santa Ana, Rev. F, High Efficiency Santa Rosa, Rev. F Santa Rosa, Rev. F, High Efficiency Santa Rosa, Rev. F Santa Rosa, Rev. F, High Efficiency

AMD dual-core die. [AMD]

AMD dual-core die


17.1  AMD Athlon 64 X2 Dual-Core processor


17.1.1  AMD Athlon 64 X2 Dual-Core processor (Manchester, Rev. E4)

Identification


Model name: Athlon 64 X2 Dual-Core.
Code name: Manchester, Rev. E4.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Athlon 64 X2 Dual-Core processor (mirror). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

AMD Athlon 64 X2 Dual-Core processor (front). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Power dissipation Temperature Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 3600+ CPU (2x) 256 kbyte L2 10 110 W TDP max. 49-65 °C April 2006 OEM: ADA3600DAA4BV
200/2000 MHz AMD Athlon 64 X2 3600+ CPU (2x) 256 kbyte L2 10 89 W TDP max. 49-71 °C April 2006 OEM: ADA3600DAA4BV
200/2000 MHz AMD Athlon 64 X2 3800+ CPU (2x) 512 kbyte L2 10 89 W TDP max. 49-71 °C August 2005 OEM: ADA3800DAA5BV,
PIB: ADA3800BVBOX
200/2200 MHz AMD Athlon 64 X2 4200+ CPU (2x) 512 kbyte L2 11 89 W TDP max. 49-71 °C May 2005 OEM: ADA4200DAA5BV,
PIB: ADA4200BVBOX
200/2400 MHz AMD Athlon 64 X2 4600+ CPU (2x) 512 kbyte L2 12 110 W TDP max. 49-65 °C May 2005 OEM: ADA4600DAA5BV,
PIB: ADA4600BVBOX

AMD Athlon 64 X2 Dual-Core processor (front). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Physics


Voltage: 1.30-1.35 V.

Manufacturing process: 90 nm.

Number of transistors: 154 million.

Die size: 147 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E4.

17.1.2  AMD Athlon 64 processor (Manchester, Rev. E4, Single Core)

Identification


Model name: Athlon 64.
Code name: Manchester, Rev. E4, Single Core.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: single core (other core disfunctional/disabled).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Athlon 64 3200+ CPU 10 May 2005 OEM: ADA3200DKA4CG,
PIB: ADA3200CGBOX
200/2200 MHz AMD Athlon 64 3500+ CPU 11 May 2005 OEM: ADA3500DKA4CG,
PIB: ADA3500CGBOX

Physics


Voltage: 1.35 V.
Power dissipation: 67 W TDP.

Temperature: 49-65 °C.

Manufacturing process: 90 nm.

Number of transistors: 154 million.

Die size: 147 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E4.

17.1.3  AMD Athlon 64 X2 Dual-Core processor (Toledo, Rev. E6)

Identification


Model name: Athlon 64 X2 Dual-Core.
Code name: Toledo, Rev. E6.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Athlon 64 X2 Dual-Core processor (front). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte or 512 kbyte (other 512 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

AMD Athlon 64 X2 Dual-Core processor (front and back). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Power dissipation Temperature Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 3800+ CPU (2x) 512 kbyte L2 10 89 W TDP max. 49-71 °C August 2005 OEM: ADA3800DAA5CD,
PIB: ADA3800CDBOX
200/2200 MHz AMD Athlon 64 X2 4200+ CPU (2x) 512 kbyte L2 11 89 W TDP max. 49-71 °C May 2005 OEM: ADA4200DAA5CD,
PIB: ADA4200CDBOX
200/2200 MHz AMD Athlon 64 X2 4400+ CPU (2x) 1024 kbyte L2 11 110 W TDP max. 49-65 °C May 2005 OEM: ADA4400DAA6CD,
PIB: ADA4400CDBOX
200/2200 MHz AMD Athlon 64 X2 4400+ CPU (2x) 1024 kbyte L2 11 89 W TDP max. 49-71 °C   OEM: ADV4400DAA6CD,
PIB: ADV4400CDBOX
200/2400 MHz AMD Athlon 64 X2 4600+ CPU (2x) 512 kbyte L2 12 110 W TDP max. 49-65 °C May 2005 OEM: ADA4600DAA5CD,
PIB: ADA4600CDBOX
200/2400 MHz AMD Athlon 64 X2 4800+ CPU (2x) 1024 kbyte L2 12 110 W TDP max. 49-65 °C May 2005 OEM: ADA4800DAA6CD,
PIB: ADA4800CDBOX

AMD Athlon 64 X2 Dual-Core processor (Socket AM2, Processor-In-a-Box). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Physics


Voltage: 1.30-1.35 V.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E6.

17.1.4  AMD Athlon 64 processor (Toledo, Rev. E6, Single Core)

Identification


Model name: Athlon 64.
Code name: Toledo, Rev. E6, Single Core.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: single core (other core disfunctional/disabled).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Order part numbers
200/2200 MHz AMD Athlon 64 3700+ CPU 11 OEM: ADA3700DKA5CF,
PIB: ADA3700CFBOX
200/2400 MHz AMD Athlon 64 4000+ CPU 12 OEM: ADA4000DKA5CF,
PIB: ADA4000CFBOX

Physics


Voltage: 1.35 V.
Power dissipation: 89 W TDP.

Temperature: 49-71 °C.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E6.

17.1.5  AMD Athlon 64 X2 Dual-Core processor (Windsor 2MB, Rev. F)

Identification


Model name: Athlon 64 X2 Dual-Core.
Code name: Windsor 2MB, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

AMD Athlon 64 X2 Dual-Core processor (mirror). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Voltage Power dissipation Temperature Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 4000+ CPU 10 1.30-1.35 V 89 W TDP max. 55-70 °C May 2006 OEM (stepping F2): ADA4000IAA6CS,
PIB (stepping F2): ADA4000CSBOX
200/2200 MHz AMD Athlon 64 X2 4400+ CPU 11 1.30-1.35 V 89 W TDP max. 55-70 °C May 2006 OEM (stepping F2): ADA4400IAA6CS,
PIB (stepping F2): ADA4400CSBOX
200/2400 MHz AMD Athlon 64 X2 4800+ CPU 12 1.30-1.35 V 89 W TDP max. 55-70 °C May 2006 OEM (stepping F2): ADA4800IAA6CS,
PIB (stepping F2): ADA4800CSBOX
200/2600 MHz AMD Athlon 64 X2 5000+ 1 CPU 13 1.30-1.35 V 89 W TDP max. 55-70 °C May 2006 OEM (stepping F2): ADA5000IAA5CS,
PIB (stepping F2): ADA5000CSBOX,
OEM (stepping F3): ADA5000IAA5CZ,
PIB (stepping F3): ADA5000CZBOX
200/2600 MHz AMD Athlon 64 X2 5200+ CPU 13 1.30-1.35 V 89 W TDP max. 55-70 °C September 2006 OEM (stepping F2): ADA5200IAA6CS,
PIB (stepping F2): ADA5200CSBOX
200/2600 MHz AMD Athlon 64 X2 5200+ CPU 13 1.20-1.25 V 89 W TDP max. 55-70 °C   OEM (stepping F3): ADA5200IAA6CZ,
PIB (stepping F3): ADA5200CZBOX
200/2800 MHz AMD Athlon 64 X2 5400+ 1 CPU 14 1.30-1.35 V 89 W TDP max. 55-70 °C December 2006 OEM (stepping F3): ADA5400IAA5CZ,
PIB (stepping F3): ADA5400CZBOX
200/2800 MHz AMD Athlon 64 X2 5600+ CPU 14 1.30-1.35 V 89 W TDP max. 55-70 °C December 2006 OEM (stepping F3): ADA5600IAA6CZ,
PIB (stepping F3): ADA5600CZBOX
Clock speed Model Multiplier Voltage Power dissipation Temperature Introduction Order part numbers
200/3000 MHz AMD Athlon 64 X2 6000+ CPU 15 1.35-1.40 V 125 W TDP max. 55-63 °C February 2007 OEM (stepping F3): ADX6000IAA6CZ,
PIB (stepping F3): ADX6000CZBOX
200/3000 MHz AMD Athlon 64 X2 6000+ CPU 15 1.30-1.35 V 89 W TDP max. 55-70 °C August 2007 OEM (stepping F3): ADA6000IAA6CZ,
PIB (stepping F3): ADA6000CZBOX
200/3200 MHz AMD Athlon 64 X2 6400+ Black Edition 2 CPU 16 1.35-1.40 V 125 W TDP max. 55-63 °C August 2007 OEM (stepping F3): ADX6400IAA6CZ,
PIB (stepping F3): ADX6400CZBOX,
WOF (stepping F3): ADX6400CZWOF

  1. (2x) 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled)
  2. no unlocked multiplier (-16x)

Physics


Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

17.1.6  AMD Athlon 64 X2 Dual-Core processor (Windsor 1MB, Rev. F)

Identification


Model name: Athlon 64 X2 Dual-Core.
Code name: Windsor 1MB, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

AMD Athlon 64 X2 Dual-Core processor (front and back). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 3800+ CPU 10 May 2006 OEM (stepping F2): ADA3800IAA5CU,
PIB (stepping F2): ADA3800CUBOX
200/2200 MHz AMD Athlon 64 X2 4200+ CPU 11 May 2006 OEM (stepping F2): ADA4200IAA5CU,
PIB (stepping F2): ADA4200CUBOX
200/2400 MHz AMD Athlon 64 X2 4600+ CPU 12 May 2006 OEM (stepping F2): ADA4600IAA5CU,
PIB (stepping F2): ADA4600CUBOX
200/2600 MHz AMD Athlon 64 X2 5000+ CPU 13 September 2006 OEM (stepping F2): ADA5000IAA5CU,
PIB (stepping F2): ADA5000CUBOX

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 89 W TDP

Temperature: max. 55-70 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8 million.

Die size: 183 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30, Dresden, Germany.

Step level


Text:

Step levels: F2.

17.1.7  AMD Athlon 64 X2 EE Dual-Core processor (Windsor 2MB, Rev. F, Energy Efficient)

Identification


Model name: Athlon 64 X2 EE Dual-Core.
Code name: Windsor 2MB, Rev. F, Energy Efficient.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

AMD Athlon 64 X2 Dual-Core processor (front and back). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 3800+ EE 1 CPU 10 May 2006 OEM (stepping F2): ADO3800IAA5CS,
PIB (stepping F2): ADO3800CSBOX,
OEM (stepping F3): ADO3800IAA5CZ,
PIB (stepping F3): ADO3800CZBOX
200/2000 MHz AMD Athlon 64 X2 4000+ EE CPU 10 May 2006 OEM (stepping F2): ADO4000IAA6CS,
PIB (stepping F2): ADO4000CSBOX
200/2200 MHz AMD Athlon 64 X2 4400+ EE CPU 11 May 2006 OEM (stepping F2): ADO4400IAA6CS,
PIB (stepping F2): ADO4400CSBOX
200/2400 MHz AMD Athlon 64 X2 4600+ EE 1 CPU 12 May 2006 OEM (stepping F2): ADO4600IAA5CS,
PIB (stepping F2): ADO4600CSBOX,
OEM (stepping F3): ADO4600IAA5CZ,
PIB (stepping F3): ADO4600CZBOX
200/2400 MHz AMD Athlon 64 X2 4800+ EE CPU 12 May 2006 OEM (stepping F2): ADO4800IAA6CS,
PIB (stepping F2): ADO4800CSBOX
200/2600 MHz AMD Athlon 64 X2 5000+ EE 1 CPU 13 February 2007 OEM (stepping F3): ADO5000IAA5CZ,
PIB (stepping F3): ADO5000CZBOX
200/2600 MHz AMD Athlon 64 X2 5200+ EE CPU 13 February 2007 OEM (stepping F3): ADO5200IAA6CZ,
PIB (stepping F3): ADO5200CZBOX

  1. (2x) 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled)

Physics


Voltage: 1.20-1.25 V.
Power dissipation: 65 W TDP

Temperature: max. 55-72 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels:

  • F2,
  • F3 (February 20, 2007).

17.1.8  AMD Athlon 64 X2 EE Dual-Core processor (Windsor 1MB, Rev. F, Energy Efficient)

Identification


Model name: Athlon 64 X2 EE Dual-Core.
Code name: Windsor 1MB, Rev. F, Energy Efficient.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

AMD Athlon 64 X2 Dual-Core processor (front). [AMD]

AMD Athlon 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 3600+ EE 1 CPU 10 August 2006 OEM (stepping F2): ADO3600IAA4CU,
PIB (stepping F2): ADO3600CUBOX
200/2000 MHz AMD Athlon 64 X2 3800+ EE CPU 10 May 2006 OEM (stepping F2): ADO3800IAA5CU,
PIB (stepping F2): ADO3800CUBOX
200/2200 MHz AMD Athlon 64 X2 4200+ EE CPU 11 May 2006 OEM (stepping F2): ADO4200IAA5CU,
PIB (stepping F2): ADO4200CUBOX
200/2400 MHz AMD Athlon 64 X2 4600+ EE CPU 12 May 2006 OEM (stepping F2): ADO4600IAA5CU,
PIB (stepping F2): ADO4600CUBOX

  1. (2x) 256 kbyte L2 cache (other 256 kbyte disfunctional/disabled)

Physics


Voltage: 1.20-1.25 V.
Power dissipation: 65 W TDP

Temperature: max. 55-72 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8 million.

Die size: 183 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30, Dresden, Germany.

Step level


Text:

Step levels: F2.

17.1.9  AMD Athlon 64 X2 EE SFF Dual-Core processor (Windsor 1MB, Rev. F, Energy Efficient Small Form Factor)

Identification


Model name: Athlon 64 X2 EE SFF Dual-Core.
Code name: Windsor 1MB, Rev. F, Energy Efficient Small Form Factor.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Temperature Introduction Order part numbers
200/2000 MHz AMD Athlon 64 X2 3800+ EE SFF CPU 10 max. 55-78 °C May 2006 OEM (stepping F2): ADD3800IAA5CU,
PIB (stepping F2): ADD3800CUBOX
200/2000 MHz AMD Athlon 64 X2 3800+ EE SFF CPU 10 max. 49-78 °C   OEM (stepping F2): ADD3800IAT5CU,
PIB (stepping F2): ADD3800CUBOX

Physics


Voltage: 1.025-1.075 V.
Power dissipation: 35 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8 million.

Die size: 183 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30, Dresden, Germany.

Step level


Text:

Step levels: F2.

17.1.10  AMD Athlon 64 X2 EE Dual-Core processor (Brisbane, Rev. G, Energy Efficient, 65 W TDP)

Identification


Model name: Athlon 64 X2 EE Dual-Core.
Code name: Brisbane, Rev. G, Energy Efficient, 65 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1900 MHz AMD Athlon 64 X2 3600+ EE 1 CPU 9.5 January 2007 OEM (stepping G1): ADO3600IAA5DD,
PIB (stepping G1): ADO3600DDBOX,
OEM (stepping G1): ADO3600IAA5DL,
PIB (stepping G1): ADO3600DLBOX
200/2100 MHz AMD Athlon 64 X2 4000+ EE CPU 10.5 December 2006 OEM (stepping G1): ADO4000IAA5DD,
PIB (stepping G1): ADO4000DDBOX
200/2200 MHz AMD Athlon 64 X2 4200+ EE CPU 11 2007 OEM (stepping G1): ADO4200IAA5DD,
PIB (stepping G1): ADO4200DDBOX,
OEM (stepping G2): ADO4200IAA5DO,
PIB (stepping G2): ADO4200DOBOX
200/2300 MHz AMD Athlon 64 X2 4400+ EE CPU 11.5 December 2006 OEM (stepping G1): ADO4400IAA5DD,
PIB (stepping G1): ADO4400DDBOX,
OEM (stepping G2): ADO4400IAA5DO,
PIB (stepping G2): ADO4400DOBOX
200/2400 MHz AMD Athlon 64 X2 4600+ EE CPU 12   OEM (stepping G2): ADO4600IAA5DO,
PIB (stepping G2): ADO4600DOBOX
200/2500 MHz AMD Athlon 64 X2 4800+ EE CPU 12.5 December 2006 OEM (stepping G1): ADO4800IAA5DD,
PIB (stepping G1): ADO4800DDBOX,
OEM (stepping G2): ADO4800IAA5DO,
PIB (stepping G2): ADO4800DOBOX
200/2600 MHz AMD Athlon 64 X2 5000+ EE CPU 13 December 2006 OEM (stepping G1): ADO5000IAA5DD,
PIB (stepping G1): ADO5000DDBOX,
OEM (stepping G2): ADO5000IAA5DO,
PIB (stepping G2): ADO5000DOBOX
200/2600 MHz AMD Athlon 64 X2 5000+ EE Black Edition 2 CPU 13 (unlocked) September 2007 OEM (stepping G2): ADO5000IAA5DS,
PIB (stepping G2): ADO5000DSBOX
Clock speed Model Multiplier Introduction Order part numbers
200/2700 MHz AMD Athlon 64 X2 5200+ EE CPU 13.5   OEM (stepping G1): ADO5200IAA5DD,
PIB (stepping G1): ADO5200DDBOX,
OEM (stepping G2): ADO5200IAA5DO,
PIB (stepping G2): ADO5200DOBOX
200/2800 MHz AMD Athlon 64 X2 5400+ EE CPU 14 January 2008 OEM (stepping G2): ADO5400IAA5DO,
PIB (stepping G2): ADO5400DOBOX
200/2900 MHz AMD Athlon 64 X2 5600+ EE CPU 14.5 February 2008 OEM (stepping G2): ADO5600IAA5DO,
PIB (stepping G2): ADO5600DOBOX

AMD Athlon 64 processor (Socket AM2, Processor-In-a-Box). [AMD]

AMD Athlon 64 processor

  1. ADO3600IAA5DD: temperature max. 49-72 °C
  2. unlocked multiplier (4x-25x); voltage: 1.25-1.35 V; temperature: max. 55-72 °C

Physics


Voltage:

  • stepping G1: 1.25-1.35 V,
  • stepping G2: 1.325-1.375 V.

Power dissipation: 65 W TDP

Temperature:

  • stepping G1: max. 55-72 °C,
  • stepping G2: max. 55-68 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8/221 million.

Die size: 126/118 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • G1,
  • G2 (October 8, 2007).

17.1.11  AMD Athlon X2 EE BE-2xxx series Dual-Core processor (Brisbane, Rev. G, Energy Efficient, 45 W TDP)

Identification


Model name: Athlon X2 EE BE-2xxx series Dual-Core.
Code name: Brisbane, Rev. G, Energy Efficient, 45 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1900 MHz AMD Athlon X2 BE-2300 EE CPU 9.5 June 2007 OEM (stepping G1): ADH2300IAA5DD,
PIB (stepping G1): ADH2300DDBOX,
OEM (stepping G2): ADH2300IAA5DO,
PIB (stepping G2): ADH2300DOBOX
200/2100 MHz AMD Athlon X2 BE-2350 EE CPU 10.5 June 2007 OEM (stepping G1): ADH2350IAA5DD,
PIB (stepping G1): ADH2350DDBOX,
OEM (stepping G2): ADH2350IAA5DO,
PIB (stepping G2): ADH2350DOBOX
200/2300 MHz AMD Athlon X2 BE-2400 EE CPU 11.5 October 2007 OEM (stepping G2): ADH2400IAA5DO,
PIB (stepping G2): ADH2400DOBOX

Physics


Voltage:

  • stepping G1: 1.15-1.25 V,
  • stepping G2: 1.25 V.

Power dissipation: 45 W TDP

Temperature: max. 55-78 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8/221 million.

Die size: 126/118 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • G1,
  • G2 (October 8, 2007).

17.1.12  AMD Athlon X2 EE 4xxx series Dual-Core processor (Brisbane, Rev. G, Energy Efficient, 45 W TDP)

Identification


Model name: Athlon X2 EE 4xxx series Dual-Core.
Code name: Brisbane, Rev. G, Energy Efficient, 45 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2100 MHz AMD Athlon X2 4050e EE CPU 10.5 April 2008 OEM (stepping G2): ADH4050IAA5DO,
PIB (stepping G2): ADH4050DOBOX
200/2300 MHz AMD Athlon X2 4450e EE CPU 11.5 April 2008 OEM (stepping G2): ADH4450IAA5DO,
PIB (stepping G2): ADH4450DOBOX
200/2300 MHz AMD Athlon X2 4450B EE 1 CPU 11.5 April 2008 OEM (stepping G2): ADH445BIAA5DO,
PIB (stepping G2): ADH445BDOBOX
200/2500 MHz AMD Athlon X2 4850e EE CPU 12.5 March 2008 OEM (stepping G2): ADH4850IAA5DO,
PIB (stepping G2): ADH4850DOBOX

  1. Business Class: availability guaranteed for 24 months after release; Socket AM2+

Physics


Voltage: 1.15-1.25 V.
Power dissipation: 45 W TDP

Temperature: max. 55-78 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 221 million.

Die size: 118 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G2.

17.2  AMD Sempron X2 Dual-Core processor


17.2.1  AMD Sempron X2 Dual-Core processor (Brisbane, Rev. G)

Identification


Model name: Sempron X2 Dual-Core.
Code name: Brisbane, Rev. G.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200 MHz / 1.8 GHz AMD Sempron X2 2100 CPU 9 March 2008 OEM (stepping G1): SDO2100IAA4DD,
PIB (stepping G1): SDO2100DDBOX
200 MHz / 1.8 GHz AMD Sempron X2 2100 CPU 9 March 2008 OEM (stepping G2): SDO2100IAA4DO,
PIB (stepping G2): SDO2100DOBOX
200 MHz / 2.0 GHz AMD Sempron X2 2200 CPU 10 March 2008 OEM (stepping G2): SDO2200IAA4DO
200 MHz / 2.2 GHz AMD Sempron X2 2300 CPU 11 April 2008 OEM (stepping G2): SDO2300IAA4DO,
PIB (stepping G2): SDO2300DOBOX

Physics


Power dissipation: 65 W TDP

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8/221 million.

Die size: 126/118 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2100 CPU CAALG G1
AMD Sempron 2100 CPU NAA9G G2

17.3  AMD Athlon 64 FX Dual-Core processor


17.3.1  AMD Athlon 64 FX Dual-Core processor (Toledo, Rev. E6)

Identification


Model name: Athlon 64 FX Dual-Core.
Code name: Toledo, Rev. E6.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD President and CEO Hector Ruiz holds an Athlon 64 FX processor. [AMD]

AMD Athlon 64 FX processor

Compatibility


Dual-core technology: two cores connected through HyperTransport bus.

64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

AMD Athlon 64 FX processor (front). [AMD]

AMD Athlon 64 FX processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Unlocked clock multiplier.

Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2600 MHz AMD Athlon 64 FX-60 CPU 13 (unlocked) January 2006 OEM: ADAFX60DAA6CD,
PIB: ADAFX60CDBOX

AMD Athlon 64 FX processor (front and back). [AMD]

AMD Athlon 64 FX processor

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 110 W TDP.

Temperature: max. 49-65 °C.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E6.

17.3.2  AMD Athlon 64 FX Dual-Core processor (Windsor 2MB, Rev. F)

Identification


Model name: Athlon 64 FX Dual-Core.
Code name: Windsor 2MB, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Athlon 64 FX Dual-Core processor (mirror). [AMD]

AMD Athlon 64 FX Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

AMD Athlon 64 FX Dual-Core processor (front and back). [AMD]

AMD Athlon 64 FX Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Unlocked clock multiplier.

Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2800 MHz AMD Athlon 64 FX-62 CPU 14 (unlocked) May 2006 OEM: ADAFX62IAA6CS,
PIB: ADAFX62CSBOX

AMD Athlon 64 FX Dual-Core processor (Socket AM2, Processor-In-a-Box). [AMD]

AMD Athlon 64 FX Dual-Core processor

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 125 W TDP

Temperature: max. 55-63 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

17.3.3  AMD Quad FX platform (Windsor 2MB, Rev. F; 4x4, QuadFather)

Identification


Model name: Athlon Quad FX.
Code name: Windsor 2MB, Rev. F; 4x4, QuadFather.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x 2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x 2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Semi quad-core technology: kit of two Dual-Core processors, each sitting in its own socket and having its own memory, connected through Dual Socket Direct Connect Architecture (DSDC).

Multiplier


Unlocked clock multiplier.

Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Temperature Introduction Order part numbers
200/2600 MHz AMD Athlon 64 FX-70 CPU 13 (unlocked) max. 63 °C November 2006 OEM: ADAFX70GAA6DI,
PIB (kit): ADAFX70DIBOX
200/2800 MHz AMD Athlon 64 FX-72 CPU 14 (unlocked) max. 63 °C November 2006 OEM: ADAFX72GAA6DI,
PIB (kit): ADAFX72DIBOX
200/3000 MHz AMD Athlon 64 FX-74 CPU 15 (unlocked) max. 56 °C November 2006 OEM: ADAFX74GAA6DI,
PIB (kit): ADAFX74DIBOX
200/3200 MHz AMD Athlon 64 FX-76 CPU 16 (unlocked)     cancelled

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 125 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F3.

17.4  AMD Turion 64 X2 Dual-Core processor


17.4.1  AMD Turion 64 X2 TL series Dual-Core processor (Trinidad, Rev. F)

Identification


Model name: Turion 64 X2 TL series Dual-Core.
Code name: Trinidad, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

AMD Turion 64 X2 Dual-Core processor (front and back). [AMD]

AMD Turion 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1600 MHz AMD Turion 64 X2 TL-52 CPU 8 31 W TDP May 2006 OEM: TMDTL52HAX5CT,
PIB: TMDTL52CTWOF
200/1800 MHz AMD Turion 64 X2 TL-56 CPU 9 33 W TDP May 2006 OEM: TMDTL56HAX5CT,
PIB: TMDTL56CTWOF
200/2000 MHz AMD Turion 64 X2 TL-60 CPU 10 35 W TDP May 2006 OEM: TMDTL60HAX5CT,
PIB: TMDTL60CTWOF
200/2100 MHz AMD Turion 64 X2 TL-62 CPU 10.5 35 W TDP   OEM: TMDTL62HAX5CT
200/2200 MHz AMD Turion 64 X2 TL-64 CPU 11 35 W TDP January 2007 OEM: TMDTL64HAX5CT,
PIB: TMDTL64CTWOF

AMD Turion 64 X2 Dual-Core processor (back). [AMD]

AMD Turion 64 X2 Dual-Core processor

Physics


Voltage: 0.80-1.125 V.

Temperature: max. 95 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 154 million.

Die size: 147 mm2.

Packaging: Socket S1.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Turion 64 X2 TL-56, TL-60 CPU ADB5F F2
AMD Turion 64 X2 TL-64 CPU ADB8F F2
AMD Turion 64 X2 TL-52, TL-60 CPU CDB5F F2
AMD Turion 64 X2 TL-56, TL-60 CPU LDB5F F2
AMD Turion 64 X2 TL-64 CPU LDB8F F2
AMD Turion 64 X2 TL-52 CPU LDBGF F2

17.4.2  AMD Turion 64 X2 TL series Dual-Core processor (Taylor, Rev. F)

Identification


Model name: Turion 64 X2 TL series Dual-Core.
Code name: Taylor, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Turion 64 X2 Dual-Core processor (front and back). [AMD]

AMD Turion 64 X2 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 256 kbyte (other 256 kbyte disfunctional/disabled).

AMD Turion 64 X2 Dual-Core processor (front). [AMD]

AMD Turion 64 X2 Dual-Core processor

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1600 MHz AMD Turion 64 X2 TL-50 CPU 8 31 W TDP May 2006 OEM: TMDTL50HAX4CT,
PIB: TMDTL50CTWOF

AMD Turion 64 X2 Dual-Core processor (Processor-In-a-Box, Without Fan). [AMD]

AMD Turion 64 X2 Dual-Core processor

Physics


Voltage: 1.10 V.

Temperature: max. 95 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 154 million.

Die size: 147 mm2.

Packaging: Socket S1.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Turion 64 X2 TL-50 CPU ADB5F F2
AMD Turion 64 X2 TL-50 CPU CDB5F F2
AMD Turion 64 X2 TL-50 CPU LDB5F F2
AMD Turion 64 X2 TL-50 CPU LDB8F F2

17.4.3  AMD Turion 64 X2 TL/TK series Dual-Core processor (Tyler, Rev. G)

Identification


Model name: Turion 64 X2 TL/TK series Dual-Core.
Code name: Tyler, Rev. G.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 512 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1700 MHz AMD Turion 64 X2 TK-53 1 2 CPU 8.5 31 W TDP August 2007 OEM (stepping G1): AMDTK53HAX4DC
200/1800 MHz AMD Turion 64 X2 TK-55 1 2 CPU 9 31 W TDP August 2007 OEM (stepping G1): AMDTK55HAX4DC
200/1900 MHz AMD Turion 64 X2 TK-57 1 2 CPU 9.5 31 W TDP   OEM (stepping G2): AMDTK57HAX4DM
200/1800 MHz AMD Turion 64 X2 TL-56 CPU 9 31 W TDP May 2007 OEM (stepping G1): TMDTL56HAX5DC
200/1900 MHz AMD Turion 64 X2 TL-58 CPU 9.5 31 W TDP May 2007 OEM (stepping G1): TMDTL58HAX5DC,
OEM (stepping G2): TMDTL58HAX5DM
200/2000 MHz AMD Turion 64 X2 TL-60 CPU 10 31 W TDP May 2007 OEM (stepping G1): TMDTL60HAX5DC,
OEM (stepping G2): TMDTL60HAX5DM
200/2100 MHz AMD Turion 64 X2 TL-62 CPU 10.5 35 W TDP January 2008 OEM (stepping G2): TMDTL62HAX5DM
200/2200 MHz AMD Turion 64 X2 TL-64 CPU 11 35 W TDP May 2007 OEM (stepping G1): TMDTL64HAX5DC,
OEM (stepping G2): TMDTL64HAX5DM
Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/2300 MHz AMD Turion 64 X2 TL-66 CPU 11.5 35 W TDP May 2007 OEM (stepping G1): TMDTL66HAX5DC,
OEM (stepping G2): TMDTL66HAX5DM
200/2400 MHz AMD Turion 64 X2 TL-68 CPU 12 35 W TDP December 2007 OEM (stepping G2): TMDTL68HAX5DM

  1. (2x) 256 kbyte L2 cache (other 256 kbyte disfunctional/disabled)
  2. no AMD-V

Physics


Voltage: 1.075-1.125 V.

Temperature: max. 95 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 153.8/221 million.

Die size: 126/118 mm2.

Packaging: Socket S1.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G0, G1, G2.

S-Spec / Stepping code


Model Code Stepping
AMD Turion 64 X2 TK-57, TL-58, TL-62, TL-64, TL-66, TL-68 CPU AAA8G G2
AMD Turion 64 X2 TK-53, TL-56, TL-60, TL-64, TL-66 CPU AAAOG G1
AMD Turion 64 X2 TK-55 CPU CAARG G1

17.5  AMD Opteron Dual-Core processor

Multi-processing


Multi-processor support:

  • 1xx series: single processor,
  • 2xx series: dual processor,
  • 8xx series: for configurations with 4 or 8 processors.


17.5.1  AMD Opteron UP 100 series Dual-Core processor (Denmark, Rev. E)

Identification


Model name: Opteron UP 100 series Dual-Core.
Code name: Denmark, Rev. E.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: single processor only.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 165 Dual-Core CPU 9 August 2005 OEM: OSA165DAA6CD,
PIB: OSA165CDBOX
200/2000 MHz AMD Opteron 170 Dual-Core CPU 10 August 2005 OEM: OSA170DAA6CD,
PIB: OSA170CDBOX
200/2200 MHz AMD Opteron 175 Dual-Core CPU 11 August 2005 OEM: OSA175DAA6CD,
PIB: OSA175CDBOX
200/2400 MHz AMD Opteron 180 Dual-Core CPU 12 September 2005 OEM: OSA180DAA6CD,
PIB: OSA180CDBOX
200/2600 MHz AMD Opteron 185 Dual-Core CPU 13 March 2006 OEM: OSA185DAA6CD,
PIB: OSA185CDBOX

AMD Opteron Dual-Core processor (left), 90 nm single-core Opteron processor (middle), and 130 nm single-core Opteron processor (right). [AMD]

AMD Opteron Dual-Core processor and single-core Opteron processors

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 110 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E6.

17.5.2  AMD Opteron DP 200 series Dual-Core processor (Italy, Rev. E)

Identification


Model name: Opteron DP 200 series Dual-Core.
Code name: Italy, Rev. E.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1 Mbyte.

AMD Opteron 64 Dual-Core processor (front). [AMD]

AMD Opteron 64 Dual-Core processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided Registered PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: dual processor.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 265 Dual-Core CPU 9 May 2005 OEM: OSA265FAA6CB,
PIB: OSA265CBBOX
200/2000 MHz AMD Opteron 270 Dual-Core CPU 10 May 2005 OEM: OSA270FAA6CB,
PIB: OSA270CBBOX
200/2200 MHz AMD Opteron 275 Dual-Core CPU 11 May 2005 OEM: OSA275FAA6CB,
PIB: OSA275CBBOX
200/2400 MHz AMD Opteron 280 Dual-Core CPU 12 September 2005 OEM: OSA280FAA6CB,
PIB: OSA280CBBOX
200/2600 MHz AMD Opteron 285 Dual-Core CPU 13 March 2006 OEM: OSA285FAA6CB,
PIB: OSA285CBBOX
200/2800 MHz AMD Opteron 290 Dual-Core CPU 14   OEM: OSA290FAA6CB,
PIB: OSA290CBBOX

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 95 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E6.

17.5.3  AMD Opteron DP HE 200 series Dual-Core processor (Italy, Rev. E, High Efficiency)

Identification


Model name: Opteron DP HE 200 series Dual-Core.
Code name: Italy, Rev. E, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided Registered PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: dual processor.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Opteron 260 HE Dual-Core CPU 8 August 2005 OEM: OSK260FAA6CB
200/1800 MHz AMD Opteron 265 HE Dual-Core CPU 9 August 2005 OEM: OSK265FAA6CB
200/2000 MHz AMD Opteron 270 HE Dual-Core CPU 10 December 2005 OEM: OSK270FAA6CB
200/2200 MHz AMD Opteron 275 HE Dual-Core CPU 11 February 2006 OEM: OSK275FAA6CB

Physics


Voltage: 1.15-1.20 V.
Power dissipation: 55 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E6.

17.5.4  AMD Opteron MP 800 series Dual-Core processor (Egypt, Rev. E)

Identification


Model name: Opteron MP 800 series Dual-Core.
Code name: Egypt, Rev. E.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1 Mbyte.

AMD Opteron 64 Dual-Core processor (front and back). [AMD]

AMD Opteron 64 Dual-Core processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided Registered PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: up to eight processors.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 865 Dual-Core CPU 9 April 2005 OEM (stepping E1): OSA865FKM6BS,
OEM (stepping E6): OSA865FAA6CC
200/2000 MHz AMD Opteron 870 Dual-Core CPU 10 April 2005 OEM (stepping E1): OSA870FKM6BS,
OEM (stepping E6): OSA870FAA6CC
200/2200 MHz AMD Opteron 875 Dual-Core CPU 11 April 2005 OEM (stepping E1): OSA875FKA6BS,
OEM (stepping E1): OSA875FKM6BS,
OEM (stepping E6): OSA875FAA6CC
200/2400 MHz AMD Opteron 880 Dual-Core CPU 12 September 2005 OEM (stepping E6): OSA880FAA6CC
200/2600 MHz AMD Opteron 885 Dual-Core CPU 13 March 2006 OEM (stepping E6): OSA885FAA6CC
200/2800 MHz AMD Opteron 890 Dual-Core CPU 14   OEM (stepping E6): OSA890FAA6CC

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 95 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E1, E6.

17.5.5  AMD Opteron MP HE 800 series Dual-Core processor (Egypt, Rev. E, High Efficiency)

Identification


Model name: Opteron MP HE 800 series Dual-Core.
Code name: Egypt, Rev. E, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided Registered PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: up to eight processors.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Opteron 860 HE Dual-Core CPU 8 August 2005 OEM (stepping E6): OSK860FAA6CC
200/1800 MHz AMD Opteron 865 HE Dual-Core CPU 9 August 2005 OEM (stepping E6): OSK865FAA6CC
200/2000 MHz AMD Opteron 870 HE Dual-Core CPU 10 December 2005 OEM (stepping E6): OSK870FAA6CC
200/2200 MHz AMD Opteron 875 HE Dual-Core CPU 11 February 2006 OEM (stepping E6): OSK875FAA6CC

Physics


Voltage: 1.15-1.20 V.
Power dissipation: 55 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 233 million.

Die size: 199 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E1, E6.

17.5.6  AMD Opteron UP 1000 series Dual-Core processor (Santa Ana, Rev. F)

Identification


Model name: Opteron UP 1000 series Dual-Core.
Code name: Santa Ana, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: single processor only.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 1210 Dual-Core CPU 9 August 2006 OEM (stepping F2): OSA1210IAA6CS,
PIB (stepping F2): OSA1210CSBOX,
OEM (stepping F3): OSA1210IAA6CZ,
PIB (stepping F3): OSA1210CZBOX
200/2000 MHz AMD Opteron 1212 Dual-Core CPU 10 August 2006 OEM (stepping F2): OSA1212IAA6CS,
PIB (stepping F2): OSA1212CSBOX,
OEM (stepping F3): OSA1212IAA6CZ,
PIB (stepping F3): OSA1212CZBOX
200/2200 MHz AMD Opteron 1214 Dual-Core CPU 11 August 2006 OEM (stepping F2): OSA1214IAA6CS,
PIB (stepping F2): OSA1214CSBOX,
OEM (stepping F3): OSA1214IAA6CZ,
PIB (stepping F3): OSA1214CZBOX
200/2400 MHz AMD Opteron 1216 Dual-Core CPU 12 August 2006 OEM (stepping F2): OSA1216IAA6CS,
PIB (stepping F2): OSA1216CSBOX,
OEM (stepping F3): OSA1216IAA6CZ,
PIB (stepping F3): OSA1216CZBOX
200/2600 MHz AMD Opteron 1218 Dual-Core CPU 13 August 2006 OEM (stepping F2): OSA1218IAA6CS,
PIB (stepping F2): OSA1218CSBOX,
OEM (stepping F3): OSA1218IAA6CZ,
PIB (stepping F3): OSA1218CZBOX
200/2800 MHz AMD Opteron 1220 SE Dual-Core 1 CPU 14 August 2006 OEM (stepping F2): OSX1220IAA6CS,
PIB (stepping F2): OSX1220CSBOX,
OEM (stepping F3): OSX1220IAA6CZ
200/2800 MHz AMD Opteron 1220 Dual-Core CPU 14 February 2007 OEM (stepping F3): OSA1220IAA6CZ,
PIB (stepping F3): OSA1220CZBOX
200/3000 MHz AMD Opteron 1222 SE Dual-Core 1 CPU 15 April 2007 OEM (stepping F3): OSX1222IAA6CZ,
PIB (stepping F3): OSA1222CZBOX
Clock speed Model Multiplier Introduction Order part numbers
200/3000 MHz AMD Opteron 1222 Dual-Core CPU 15 August 2007 OEM (stepping F3): OSA1222IAA6CZ,
PIB (stepping F3): OSA1222CZBOX
200/3200 MHz AMD Opteron 1224 SE Dual-Core 1 CPU 16   OEM (stepping F3): OSX1224IAA6CZ

  1. Special Edition (SE): voltage: 1.35-1.40 V, power dissipation: 125 W TDP

AMD Opteron Dual-Core processor (right) and 90 nm single-core Opteron processor (left). [AMD]

AMD Opteron Dual-Core processor and single-core Opteron processor

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 103 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

17.5.7  AMD Opteron UP HE 1000 series Dual-Core processor (Santa Ana, Rev. F, High Efficiency)

Identification


Model name: Opteron UP HE 1000 series Dual-Core.
Code name: Santa Ana, Rev. F, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Opteron 64 Dual-Core processor (front). [AMD]

AMD Opteron 64 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: single processor only.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 1210 HE Dual-Core CPU 9 February 2007 OEM (stepping F3): OSO1210IAA6CZ,
PIB (stepping F3): OSO1210CZWOF
200/2000 MHz AMD Opteron 1212 HE Dual-Core CPU 10 February 2007 OEM (stepping F3): OSO1212IAA6CZ,
PIB (stepping F3): OSO1212CZWOF
200/2200 MHz AMD Opteron 1214 HE Dual-Core CPU 11 February 2007 OEM (stepping F3): OSO1214IAA6CZ,
PIB (stepping F3): OSO1214CZWOF
200/2400 MHz AMD Opteron 1216 HE Dual-Core CPU 12 February 2007 OEM (stepping F3): OSO1216IAA6CZ,
PIB (stepping F3): OSO1216CZWOF
200/2600 MHz AMD Opteron 1218 HE Dual-Core CPU 13 February 2007 OEM (stepping F3): OSO1218IAA6CZ,
PIB (stepping F3): OSO1218CZWOF

Physics


Voltage: 1.20-1.25 V.
Power dissipation: 65 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F3.

17.5.8  AMD Opteron DP 2000 series Dual-Core processor (Santa Rosa, Rev. F)

Identification


Model name: Opteron DP 2000 series Dual-Core.
Code name: Santa Rosa, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Opteron 64 Dual-Core processor (front). [AMD]

AMD Opteron 64 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Registered PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: dual processor.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 2210 Dual-Core CPU 9 August 2006 OEM (stepping F2): OSA2210GAA6CQ,
PIB (stepping F2): OSA2210CQWOF,
OEM (stepping F3): OSA2210GAA6CX,
PIB (stepping F3): OSA2210CXWOF
200/2000 MHz AMD Opteron 2212 Dual-Core CPU 10 August 2006 OEM (stepping F2): OSA2212GAA6CQ,
PIB (stepping F2): OSA2212CQWOF,
OEM (stepping F3): OSA2212GAA6CX,
PIB (stepping F3): OSA2212CXWOF
200/2200 MHz AMD Opteron 2214 Dual-Core CPU 11 August 2006 OEM (stepping F2): OSA2214GAA6CQ,
PIB (stepping F2): OSA2214CQWOF,
OEM (stepping F3): OSA2214GAA6CX,
PIB (stepping F3): OSA2214CXWOF
200/2400 MHz AMD Opteron 2216 Dual-Core CPU 12 August 2006 OEM (stepping F2): OSA2216GAA6CQ,
PIB (stepping F2): OSA2216CQWOF,
OEM (stepping F3): OSA2216GAA6CX,
PIB (stepping F3): OSA2216CXWOF
200/2600 MHz AMD Opteron 2218 Dual-Core CPU 13 August 2006 OEM (stepping F2): OSA2218GAA6CQ,
PIB (stepping F2): OSA2218CQWOF,
OEM (stepping F3): OSA2218GAA6CX,
PIB (stepping F3): OSA2218CXWOF
200/2800 MHz AMD Opteron 2220 SE Dual-Core 1 CPU 14 August 2006 OEM (stepping F2): OSY2220GAA6CQ,
PIB (stepping F2): OSY2220CQWOF,
OEM (stepping F3): OSY2220GAA6CX
200/2800 MHz AMD Opteron 2220 Dual-Core CPU 14 February 2007 OEM (stepping F3): OSA2220GAA6CX,
PIB (stepping F3): OSA2220CXWOF
200/3000 MHz AMD Opteron 2222 SE Dual-Core 1 CPU 15 April 2007 OEM (stepping F3): OSY2222GAA6CX,
PIB (stepping F3): OSA2222CXWOF
Clock speed Model Multiplier Introduction Order part numbers
200/3000 MHz AMD Opteron 2222 Dual-Core CPU 15 August 2007 OEM (stepping F3): OSA2222GAA6CX,
PIB (stepping F3): OSA2222CXWOF
200/3200 MHz AMD Opteron 2224 SE Dual-Core 1 CPU 16 August 2007 OEM (stepping F3): OSY2224GAA6CX,
PIB (stepping F3): OSA2224CXWOF

  1. Special Edition (SE): voltage: 1.325-1.375 V, power dissipation: 119 W TDP

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 95 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

17.5.9  AMD Opteron DP HE 2000 series Dual-Core processor (Santa Rosa, Rev. F, High Efficiency)

Identification


Model name: Opteron DP HE 2000 series Dual-Core.
Code name: Santa Rosa, Rev. F, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Registered PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: dual processor.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Opteron 2210 HE Dual-Core CPU 9 August 2006 OEM (stepping F2): OSP2210GAA6CQ,
PIB (stepping F2): OSP2210CQWOF,
OEM (stepping F3): OSP2210GAA6CX,
PIB (stepping F3): OSP2210CXWOF
200/2000 MHz AMD Opteron 2212 HE Dual-Core CPU 10 August 2006 OEM (stepping F2): OSP2212GAA6CQ,
PIB (stepping F2): OSP2212CQWOF,
OEM (stepping F3): OSP2212GAA6CX,
PIB (stepping F3): OSP2212CXWOF
200/2200 MHz AMD Opteron 2214 HE Dual-Core CPU 11 August 2006 OEM (stepping F2): OSP2214GAA6CQ,
PIB (stepping F2): OSP2214CQWOF,
OEM (stepping F3): OSP2214GAA6CX,
PIB (stepping F3): OSP2214CXWOF
200/2400 MHz AMD Opteron 2216 HE Dual-Core CPU 12 August 2006 OEM (stepping F2): OSP2216GAA6CQ,
PIB (stepping F2): OSP2216CQWOF,
OEM (stepping F3): OSP2216GAA6CX,
PIB (stepping F3): OSP2216CXWOF
200/2600 MHz AMD Opteron 2218 HE Dual-Core CPU 13 February 2007 OEM (stepping F3): OSP2218GAA6CX,
PIB (stepping F3): OSP2218CXWOF

Physics


Voltage: 1.20-1.25 V.
Power dissipation: 68 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

17.5.10  AMD Opteron MP 8000 series Dual-Core processor (Santa Rosa, Rev. F)

Identification


Model name: Opteron MP 8000 series Dual-Core.
Code name: Santa Rosa, Rev. F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Opteron 64 Dual-Core processor (front). [AMD]

AMD Opteron 64 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Registered PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: up to eight processors.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 8212 Dual-Core CPU 10 August 2006 OEM (stepping F2): OSA8212GAA6CR,
PIB (stepping F2): OSA8212CRWOF,
OEM (stepping F3): OSA8212GAA6CY,
PIB (stepping F3): OSA8212CYWOF
200/2200 MHz AMD Opteron 8214 Dual-Core CPU 11 August 2006 OEM (stepping F2): OSA8214GAA6CR,
PIB (stepping F2): OSA8214CRWOF,
OEM (stepping F3): OSA8214GAA6CY,
PIB (stepping F3): OSA8214CYWOF
200/2400 MHz AMD Opteron 8216 Dual-Core CPU 12 August 2006 OEM (stepping F2): OSA8216GAA6CR,
PIB (stepping F2): OSA8216CRWOF,
OEM (stepping F3): OSA8216GAA6CY,
PIB (stepping F3): OSA8216CYWOF
200/2600 MHz AMD Opteron 8218 Dual-Core CPU 13 August 2006 OEM (stepping F2): OSA8218GAA6CR,
PIB (stepping F2): OSA8218CRWOF,
OEM (stepping F3): OSA8218GAA6CY,
PIB (stepping F3): OSA8218CYWOF
200/2800 MHz AMD Opteron 8220 SE Dual-Core 1 CPU 14 August 2006 OEM (stepping F2): OSY8220GAA6CR,
PIB (stepping F2): OSY8220CRWOF,
OEM (stepping F3): OSY8220GAA6CY
200/2800 MHz AMD Opteron 8220 Dual-Core CPU 14 February 2007 OEM (stepping F3): OSA8220GAA6CY,
PIB (stepping F3): OSA8220CYWOF
200/3000 MHz AMD Opteron 8222 SE Dual-Core 1 CPU 15 April 2007 OEM (stepping F3): OSY8222GAA6CY,
PIB (stepping F3): OSA8222CYWOF
200/3000 MHz AMD Opteron 8222 Dual-Core CPU 15 August 2007 OEM (stepping F3): OSA8222GAA6CY,
PIB (stepping F3): OSA8222CYWOF
Clock speed Model Multiplier Introduction Order part numbers
200/3200 MHz AMD Opteron 8224 SE Dual-Core 1 CPU 16 August 2007 OEM (stepping F3): OSY8224GAA6CY,
PIB (stepping F3): OSA8224CYWOF

  1. Special Edition (SE): voltage: 1.325-1.375 V, power dissipation: 120 W TDP

Physics


Voltage: 1.30-1.35 V.
Power dissipation: 95 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

17.5.11  AMD Opteron MP HE 8000 series Dual-Core processor (Santa Rosa, Rev. F, High Efficiency)

Identification


Model name: Opteron MP HE 8000 series Dual-Core.
Code name: Santa Rosa, Rev. F, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8D.

AMD Opteron 64 Dual-Core processor (front). [AMD]

AMD Opteron 64 Dual-Core processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Registered PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing


Dual-core technology: two cores connected through HyperTransport bus.

Multi-processor support: up to eight processors.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 8212 HE Dual-Core CPU 10 August 2006 OEM (stepping F2): OSP8212GAA6CR,
PIB (stepping F2): OSP8212CRWOF,
OEM (stepping F3): OSP8212GAA6CY
200/2200 MHz AMD Opteron 8214 HE Dual-Core CPU 11 August 2006 OEM (stepping F2): OSP8214GAA6CR,
PIB (stepping F2): OSP8214CRWOF,
OEM (stepping F3): OSP8214GAA6CY
200/2400 MHz AMD Opteron 8216 HE Dual-Core CPU 12 August 2006 OEM (stepping F2): OSP8216GAA6CR,
PIB (stepping F2): OSP8216CRWOF,
OEM (stepping F3): OSP8216GAA6CY
200/2600 MHz AMD Opteron 8218 HE Dual-Core CPU 13 February 2007 OEM (stepping F3): OSP8218GAA6CY

Physics


Voltage: 1.20-1.25 V.
Power dissipation: 68 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm2.

Packaging: Socket F.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

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