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15  AMD Athlon 64 processors

15.1  AMD Athlon 64 processor


15.1.1  AMD Athlon 64 processor (Clawhammer, revision C0, Socket 754)

Identification


Model name: Athlon 64.
Code name: Clawhammer, revision C0.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD President and CEO Hector Ruiz holds an Athlon 64 processor. [AMD]

AMD Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte or 512 kbyte (other 512 kbyte disfunctional/disabled).

AMD Athlon 64 block diagram. [AMD]

AMD Athlon 64 block diagram

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Multiplier


Power management


Power management: Cool'n'Quiet(CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Athlon 64 2800+ 1 CPU 9 April 2004 OEM: ADA2800AEP4AP,
PIB: ADA2800BOX
200/2000 MHz AMD Athlon 64 3000+ 1 CPU 10 December 2003 OEM: ADA3000AEP4AP,
PIB: ADA3000BOX
200/2000 MHz AMD Athlon 64 3200+ CPU 10 September 2003 OEM: ADA3200AEP5AP,
PIB: ADA3200BOX
200/2200 MHz AMD Athlon 64 3200+ 1 CPU 11 September 2003 OEM: ADA3200AEP4AP
200/2200 MHz AMD Athlon 64 3400+ CPU 11 January 2004 OEM: ADA3400AEP5AP,
PIB: ADA3400BOX
200/2400 MHz AMD Athlon 64 3400+ 2 CPU 12 January 2004 OEM: ADA3400AEP4AP
200/2400 MHz AMD Athlon 64 3700+ CPU 12   OEM: ADA3700AEP5AP,
PIB: ADA3700BOX

  1. 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled)
  2. Engineering Sample (ES) only

AMD Athlon 64 die plot. [AMD]

AMD Athlon 64 die plot

Physics


Voltage: 1.50 V.
Power dissipation: 89 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: C0.

15.1.2  AMD Athlon 64 processor (Clawhammer, revision CG, Socket 754)

Identification


Model name: Athlon 64.
Code name: Clawhammer, revision CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte or 512 kbyte (other 512 kbyte disfunctional/disabled).

AMD Athlon 64 processor (front and back). [AMD]

AMD Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Athlon 64 2800+ 1 CPU 9 February 2004 OEM: ADA2800AEP4AR
200/2000 MHz AMD Athlon 64 3000+ 1 CPU 10 February 2004 OEM: ADA3000AEP4AR
200/2000 MHz AMD Athlon 64 3200+ CPU 10 February 2004 OEM: ADA3200AEP5AR
200/2200 MHz AMD Athlon 64 3200+ 1 CPU 11 February 2004 OEM: ADA3200AEP4AR,
PIB: ADA3200ARBOX
200/2200 MHz AMD Athlon 64 3400+ CPU 11 February 2004 OEM: ADA3400AEP5AR
200/2400 MHz AMD Athlon 64 3400+ 1 CPU 12 February 2004 OEM: ADA3400AEP5AR,
PIB: ADA3400ARBOX
200/2400 MHz AMD Athlon 64 3700+ CPU 12 June 2004 OEM: ADA3700AEP5AR,
PIB: ADA3700ARBOX

  1. 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled)

Physics


Voltage: 1.50 V.
Power dissipation: 89 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.1.3  AMD Athlon 64 processor (Clawhammer, revision CG, Socket 939)

Identification


Model name: Athlon 64.
Code name: Clawhammer, revision CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 processor (front). [AMD]

AMD Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte or 512 kbyte (other 512 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2200 MHz AMD Athlon 64 3500+ 1 CPU 11 June 2004 OEM: ADA3500DEP4AS,
PIB: ADA3500ASBOX
200/2400 MHz AMD Athlon 64 3800+ 1 CPU 12   OEM: ADA3800DEP4AS
200/2400 MHz AMD Athlon 64 4000+ CPU 12 October 2004 OEM: ADA4000DEP5AS,
PIB: ADA4000ASBOX

  1. 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled)

Physics


Voltage: 1.50 V.
Power dissipation: 89 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: CG.

15.1.4  AMD Athlon 64 processor (Newcastle, revision CG, Socket 754)

Identification


Model name: Athlon 64.
Code name: Newcastle, revision CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 processor (front and back). [AMD]

AMD Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Athlon 64 2800+ CPU 9 April 2004 OEM: ADA2800AEP4AX,
PIB: ADA2800AXBOX
200/2000 MHz AMD Athlon 64 3000+ CPU 10 April 2004 OEM: ADA3000AEP4AX,
PIB: ADA3000AXBOX
200/2200 MHz AMD Athlon 64 3200+ CPU 11 April 2004 OEM: ADA3200AEP4AX
PIB: ADA3200AXBOX
200/2400 MHz AMD Athlon 64 3300+ 1 2 CPU 12   OEM: ADA3300AEP3AX
200/2400 MHz AMD Athlon 64 3400+ CPU 12 April 2004 OEM: ADA3400AEP4AX,
PIB: ADA3400AXBOX

  1. 256 kbyte L2 cache (other 256 kbyte disfunctional/disabled)
  2. used only in HP and IBM systems

AMD Athlon 64 die plot. [AMD]

AMD Athlon 64 die plot

Physics


Voltage: 1.50 V.
Power dissipation: 89 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.1.5  AMD Athlon 64 processor (Newcastle, revision CG, Socket 939)

Identification


Model name: Athlon 64.
Code name: Newcastle, revision CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

AMD Athlon 64 processor (front and back). [AMD]

AMD Athlon 64 processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Athlon 64 3000+ CPU 9   OEM: ADA3000DEP4AW,
PIB: ADA3000AWBOX
200/2000 MHz AMD Athlon 64 3200+ CPU 10   OEM: ADA3200DEP4AW,
PIB: ADA3200AWBOX
200/2200 MHz AMD Athlon 64 3400+ 1 CPU 11   OEM: ADA3400DEP4AZ
200/2200 MHz AMD Athlon 64 3500+ CPU 11 June 2004 OEM: ADA3500DEP4AW,
PIB: ADA3500AWBOX
200/2400 MHz AMD Athlon 64 3800+ CPU 12 June 2004 OEM: ADA3800DEP4AW,
PIB: ADA3800AWBOX

  1. 800 MHz HyperTransport bus; OEM only

Physics


Voltage: 1.50 V.
Power dissipation: 89 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: CG.

15.1.6  AMD Athlon 64 processor (Winchester, revision D0)

Identification


Model name: Athlon 64.
Code name: Winchester, revision D0.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 processor (front). [AMD]

AMD Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Athlon 64 3000+ CPU 9 October 2004 OEM: ADA3000DIK4BI,
PIB: ADA3000BIBOX
200/2000 MHz AMD Athlon 64 3200+ CPU 10 October 2004 OEM: ADA3200DIK4BI,
PIB: ADA3200BIBOX
200/2200 MHz AMD Athlon 64 3500+ CPU 11 October 2004 OEM: ADA3500DIK4BI,
PIB: ADA3500BIBOX

Physics


Voltage: 1.40 V.
Power dissipation: 67 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: D0.

15.1.7  AMD Athlon 64 processor (Venice, revision E3, E6, Socket 754)

Identification


Model name: Athlon 64.
Code name: Venice, revision E3, E6.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

AMD Athlon 64 processor (939 pin, front and back). [AMD]

AMD Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Voltage Power dissipation Temperature Introduction Order part numbers
200/1000 MHz AMD Athlon 64 1500+ 1 CPU 5 0.90 V 9 W TDP   November 2005 OEM (stepping E6): ADC1500B2X4BX
200/2000 MHz AMD Athlon 64 3000+ CPU 10 1.35 V 51 W TDP max. 65 °C   OEM (stepping E6): ADA3000AKK4BX
200/2000 MHz AMD Athlon 64 3000+ CPU 10 1.40 V 51 W TDP max. 65 °C December 2005 OEM (stepping E6): ADA3000AIK4BX,
PIB (stepping E6): ADA3000BXBOX
200/2200 MHz AMD Athlon 64 3200+ CPU 11 1.40 V 59 W TDP max. 69 °C December 2005 OEM (stepping E6): ADA3200AI04BX,
PIB (stepping E6): ADA3200BXBOX
200/2400 MHz AMD Athlon 64 3400+ 2 CPU 12 1.4 67 W TDP max. 65 °C   OEM (stepping E3): ADA3400AIK4BO

  1. used only in HP BladeSystem bc1500 blade PCs
  2. OEM only

Physics


Voltage: 1.40 V.

Manufacturing process: 90 nm.

Number of transistors: 76 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E3, E6.

15.1.8  AMD Athlon 64 processor (Venice, revision E3, E6, Socket 939)

Identification


Model name: Athlon 64.
Code name: Venice, revision E3, E6.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 processor (front and back). [AMD]

AMD Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Athlon 64 3000+ CPU 9 April 2005 OEM (stepping E3): ADA3000DAA4BP,
PIB (stepping E3): ADA3000BPBOX,
OEM (stepping E6): ADA3000DAA4BW,
PIB (stepping E6): ADA3000BWBOX
200/2000 MHz AMD Athlon 64 3200+ CPU 10 April 2005 OEM (stepping E3): ADA3200DAA4BP,
PIB (stepping E3): ADA3200BPBOX,
OEM (stepping E6): ADA3200DAA4BW,
PIB (stepping E6): ADA3200BWBOX
200/2200 MHz AMD Athlon 64 3400+ 1 CPU 11   OEM (stepping E6): ADA3400DAA4BY,
OEM (stepping E3): ADA3400DAA4BZ
200/2200 MHz AMD Athlon 64 3500+ CPU 11 April 2005 OEM (stepping E3): ADA3500DAA4BP,
PIB (stepping E3): ADA3500BPBOX,
OEM (stepping E6): ADA3500DAA4BW,
PIB (stepping E6): ADA3500BWBOX
200/2400 MHz AMD Athlon 64 3800+ 2 CPU 12 April 2005 OEM (stepping E3): ADA3800DAA4BP,
PIB (stepping E3): ADA3800BPBOX,
OEM (stepping E6): ADA3800DAA4BW,
PIB (stepping E6): ADA3800BWBOX

  1. 800 MHz HyperTransport bus; OEM only
  2. power dissipation: 89 W TDP; temperature: 49-71 °C

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 67 W TDP.

Temperature: 49-65 °C.

Manufacturing process: 90 nm.

Number of transistors: 76 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E3, E6.

15.1.9  AMD Athlon 64 processor (San Diego, revision E4)

Identification


Model name: Athlon 64.
Code name: San Diego, revision E4.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 processor (front). [AMD]

AMD Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2200 MHz AMD Athlon 64 3500+ 1 CPU 11 May 2005 OEM: ADA3500DAA4BN,
PIB: ADA3500BNBOX
200/2200 MHz AMD Athlon 64 3700+ CPU 11 May 2005 OEM: ADA3700DAA5BN,
PIB: ADA3700BNBOX
200/2400 MHz AMD Athlon 64 4000+ CPU 12 May 2005 OEM: ADA4000DAA5BN,
PIB: ADA4000BNBOX
200/2600 MHz AMD Athlon 64 4200+ CPU 13 2005 OEM: ADA4200DAA5BN,
PIB: ADA4200BNBOX,
never released

  1. 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled); 67 W TDP

AMD Athlon 64 processor (Processor-In-a-Box). [AMD]

AMD Athlon 64 processor

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 89 W TDP.

Temperature: 49-65 °C.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E4.

15.1.10  AMD Athlon 64 processor (Orleans, revision F)

Identification


Model name: Athlon 64.
Code name: Orleans, revision F.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache:

  • stepping F2: 512 kbyte,
  • stepping F3: 512 kbyte (other 512 kbyte disfunctional/disabled).

AMD Athlon 64 processor (front and back). [AMD]

AMD Athlon 64 processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Voltage Temperature Introduction Order part numbers
200/1800 MHz AMD Athlon 64 3000+ CPU 9 1.35-1.40 V max. 69 °C May 2006 OEM (stepping F2): ADA3000IAA4CN,
PIB (stepping F2): ADA3000CNBOX,
OEM (stepping F2): ADA3000IAA4CW,
PIB (stepping F2): ADA3000CWBOX
200/2000 MHz AMD Athlon 64 3200+ CPU 10 1.35-1.40 V max. 69 °C May 2006 OEM (stepping F2): ADA3200IAA4CN,
PIB (stepping F2): ADA3200CNBOX,
OEM (stepping F2): ADA3200IAA4CW,
PIB (stepping F2): ADA3200CWBOX
200/2200 MHz AMD Athlon 64 3500+ CPU 11 1.25-1.40 V max. 55-69 °C May 2006 OEM (stepping F2): ADA3500IAA4CN,
PIB (stepping F2): ADA3500CNBOX,
OEM (stepping F2): ADA3500IAA4CW,
PIB (stepping F2): ADA3500CWBOX
200/2200 MHz AMD Athlon 64 3500+ CPU 11 1.25-1.40 V max. 55-69 °C February 2007 OEM (stepping F3): ADA3500IAA4DH,
PIB (stepping F3): ADA3500DHBOX
200/2400 MHz AMD Athlon 64 3800+ CPU 12 1.25-1.40 V max. 55-69 °C May 2006 OEM (stepping F2): ADA3800IAA4CN,
PIB (stepping F2): ADA3800CNBOX,
OEM (stepping F2): ADA3800IAA4CW,
PIB (stepping F2): ADA3800CWBOX
200/2400 MHz AMD Athlon 64 3800+ CPU 12 1.25-1.40 V max. 55-69 °C February 2007 OEM (stepping F3): ADA3800IAA4DH,
PIB (stepping F3): ADA3800DHBOX
200/2600 MHz AMD Athlon 64 4000+ CPU 13 1.25-1.40 V max. 55-69 °C February 2007 OEM (stepping F3): ADA4000IAA4DH,
PIB (stepping F3): ADA4000DHBOX

Physics


Power dissipation: 62 W TDP.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors:

  • stepping F2 (512 kbyte L2 cache): 81.1 million,
  • stepping F3 (1024 kbyte L2 cache): 164 million.

Die size:

  • stepping F2 (512 kbyte L2 cache): 103.1 mm2,
  • stepping F3 (1024 L2 cache): 144 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2, F3.

S-Spec / Stepping code


Model Code Stepping
AMD Athlon 64 3700+, 3800+ CPU ABBVF F2 (CN postfix)
AMD Athlon 64 4000+ CPU ACBBF F3
AMD Athlon 64 3700+, 4000+ CPU ACBXF F2 (CW postfix)
AMD Athlon 64 3700+, 3800+ CPU ACBYF F2 (CW postfix)
AMD Athlon 64 3000+, 3200+, 3500+, 3700+, 3800+ CPU LBBVF F2 (CN postfix)
AMD Athlon 64 3000+, 3200+ CPU LDB4F F2 (CW postfix)
AMD Athlon 64 3500+ CPU LDB5F F2 (CW postfix)
AMD Athlon 64 3200+, 3500+ CPU LEBAF F2 (CN postfix)
Model Code Stepping
AMD Athlon 64 3200+, 3500+ CPU LEDBF F2 (CW postfix)
AMD Athlon 64 3000+ CPU LFBAF F2 (CN postfix)
AMD Athlon 64 3500+ CPU NBBVF F2 (CN postfix)
AMD Athlon 64 3700+, 3800+ CPU NDB4F F2 (CW postfix)
AMD Athlon 64 3500+ CPU NEBAF F2 (CN postfix)

15.1.11  AMD Athlon 64 processor (Orleans, revision F, Energy Efficient)

Identification


Model name: Athlon 64.
Code name: Orleans, revision F, Energy Efficient.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte.

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2200 MHz AMD Athlon 64 LE-1600 CPU 11 October 2007 OEM: ADH1600IAA5DH,
PIB: ADH1600DHBOX
200/2400 MHz AMD Athlon 64 LE-1620 CPU 12 October 2007 OEM: ADH1620IAA5DH,
PIB: ADH1620DHBOX
200/2600 MHz AMD Athlon 64 LE-1640 CPU 13 January 2008 OEM: ADH1640IAA5DH,
PIB: ADH1640DHBOX

Physics


Voltage: 1.25-1.40 V.
Power dissipation: 45 W TDP.

Temperature: max. 55-69 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 164 million.

Die size: 144 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

CPUID32


Type Family Model Stepping Description
0x0 0xF 0xF 0x3 stepping F3

Step level


Text:

Step levels: F3.

15.1.12  AMD Athlon 64 processor (Orleans, revision F, Energy Efficient Small Form Factor)

Identification


Model name: Athlon 64.
Code name: Orleans, revision F, Energy Efficient Small Form Factor.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

AMD Athlon 64 processor (front). [AMD]

AMD Athlon 64 processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2200 MHz AMD Athlon 64 3500+ EE SFF CPU 11 May 2006 OEM: ADD3500IAA4CN,
PIB: ADD3500CNBOX

Physics


Voltage: 1.20-1.25 V.
Power dissipation: 35 W TDP.

Temperature: max. 55-78 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 81.1 million.

Die size: 103.1 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

15.1.13  AMD Athlon 64 processor (Lima, revision G, Energy Efficient)

Identification


Model name: Athlon 64.
Code name: Lima, revision G, Energy Efficient.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

AMD Athlon 64 processor (front and back). [AMD]

AMD Athlon 64 processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Voltage Introduction Order part numbers
200/2200 MHz AMD Athlon 64 3500+ EE CPU 11 1.20-1.35 V February 2007 OEM (stepping G1): ADH3500IAA4DE,
PIB (stepping G1): ADH3500DEBOX
200/2400 MHz AMD Athlon 64 3800+ EE CPU 12 1.25-1.40 V February 2007 OEM (stepping G1): ADH3800IAA4DE,
PIB (stepping G1): ADH3800DEBOX
200/2700 MHz AMD Athlon 64 LE-1640B EE 1 CPU 13.5 1.25-1.40 V April 2008 OEM (stepping G2): ADH164BIAA4DP

  1. Business Class: availability guaranteed for 24 months after release

Physics


Power dissipation: 45 W TDP.

Temperature: max. 55-65 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

15.2  AMD Sempron 64 processor


15.2.1  AMD Sempron processor (Paris, revision CG)

Identification


Model name: Sempron.
Code name: Paris, revision CG.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 February 2005 OEM: SDA3000AIP2AX,
PIB: SDA3000AXBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 July 2004 OEM: SDA3100AIP3AX,
PIB: SDA3100AXBOX

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.2.2  AMD Sempron processor (Winchester, revision D0)

Identification


Model name: Sempron.
Code name: Winchester, revision D0.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 October 2005 OEM: SDA3000DIO2BI,
OEM: SDA3000DIO2BA
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 256 kbyte L2 9 October 2005 OEM: SDA3200DIO3BI

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3200+ CPU ABBGD D0
AMD Sempron 3000+, 3200+ CPU LBBIX D0

15.2.3  AMD Sempron processor (Palermo, revision D0)

Identification


Model name: Sempron.
Code name: Palermo, revision D0.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64 (only supported by model numbers ending in CV).

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 August 2004 OEM: SDA2600AIO2BA,
OEM (AMD64): SDA2600AIO2CV,
PIB (no AMD64): SDA2600BABOX,
PIB (AMD64): SDA2600CVBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 August 2004 OEM: SDA2800AIO3BA,
OEM (AMD64): SDA2800AIO3CV,
PIB (no AMD64): SDA2800BABOX,
PIB (AMD64): SDA2800CVBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 April 2005 OEM: SDA3000AIO2BA,
OEM (AMD64): SDA3000AIO2CV,
PIB (no AMD64): SDA3000BABOX,
PIB (AMD64): SDA3000CVBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 April 2005 OEM: SDA3100AIO3BA,
OEM (AMD64): SDA3100AIO3CV,
PIB (no AMD64): SDA3100BABOX,
PIB (AMD64): SDA3100CVBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 April 2005 OEM: SDA3300AIO2BA,
OEM (AMD64): SDA3300AIO2CV,
PIB (no AMD64): SDA3300BABOX,
PIB (AMD64): SDA3300CVBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2800+, 3300+ CPU ABBHD D0
AMD Sempron 2600+ CPU CBBHD D0
AMD Sempron 2600+, 2800+ CPU CBBID D0
AMD Sempron 2600+, 3000+ CPU LBBID D0
AMD Sempron 2600+, 2800+, 3100+ CPU LBBIX D0

15.2.4  AMD Sempron processor (Palermo, revision E3, Socket 754)

Identification


Model name: Sempron.
Code name: Palermo, revision E3.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.40 GHz AMD Sempron 2500+ 1 CPU 256 kbyte L2 7 April 2005 OEM: SDA2500AIO3BO,
PIB: SDA2500BOBOX
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 April 2005 OEM: SDA2600AIO2BO,
PIB: SDA2600BOBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 April 2005 OEM: SDA2800AIO3BO,
PIB: SDA2800BOBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 April 2005 OEM: SDA3000AIO2BO,
PIB: SDA3000BOBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 April 2005 OEM: SDA3100AIO3BO,
PIB: SDA3100BOBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 April 2005 OEM: SDA3300AIO2BO,
PIB: SDA3300BOBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E3.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3000+ CPU CBBLE E3
AMD Sempron 3300+ CPU LBBLY E3
AMD Sempron 2600+, 3000+, 3300+ CPU QBBLE E3

15.2.5  AMD Sempron processor (Palermo, revision E6, Socket 754)

Identification


Model name: Sempron.
Code name: Palermo, revision E6.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.40 GHz AMD Sempron 2500+ 1 CPU 256 kbyte L2 7 July 2005 OEM: SDA2500AIO3BX,
PIB: SDA2500BXBOX
200 MHz / 1.60 GHz AMD Sempron 2600+ 1 CPU 128 kbyte L2 8 August 2005 OEM: SDA2600AIO2BX,
PIB: SDA2600BXBOX
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 256 kbyte L2 8 July 2005 OEM: SDA2800AIO3BX,
PIB: SDA2800BXBOX
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 July 2005 OEM: SDA3000AIO2BX,
PIB: SDA3000BXBOX
200 MHz / 1.80 GHz AMD Sempron 3100+ CPU 256 kbyte L2 9 July 2005 OEM: SDA3100AIO3BX,
PIB: SDA3100BXBOX
200 MHz / 2.00 GHz AMD Sempron 3300+ CPU 128 kbyte L2 10 July 2005 OEM: SDA3300AIO2BX,
PIB: SDA3300BXBOX
200 MHz / 2.00 GHz AMD Sempron 3400+ CPU 256 kbyte L2 10 August 2005 OEM: SDA3400AIO3BX,
PIB: SDA3400BXBOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2500+, 2600+, 2800+, 3000+, 3100+, 3300+, 3400+ CPU ABBWE E6
AMD Sempron 2500+, 2600+, 2800+, 3000+, 3100+, 3300+, 3400+ CPU LBBWE E6
AMD Sempron 2500+, 2800+, 3000+ CPU LEBBE E6
AMD Sempron 2800+ CPU LEBCE E6
AMD Sempron 3000+ CPU LEBDE E6
AMD Sempron 2800+, 3000+ CPU LFBAE E6
AMD Sempron 3000+ CPU LFBBE E6
AMD Sempron 2500+, 2600+, 2800+, 3000+ CPU NBBWE E6

15.2.6  AMD Sempron processor (Palermo, revision E3, Socket 939)

Identification


Model name: Sempron.
Code name: Palermo, revision E3.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 October 2005 OEM: SDA3000DIO2BP
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 256 kbyte L2 9 October 2005 OEM: SDA3200DIO3BP

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E3.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3200+ CPU ABBGD E3
AMD Sempron 3000+, 3200+ CPU CBBLE E3
AMD Sempron 3000+ CPU LBBLY E3

15.2.7  AMD Sempron processor (Palermo, revision E6, Socket 939)

Identification


Model name: Sempron.
Code name: Palermo, revision E6.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Sempron 3000+ CPU 128 kbyte L2 9 October 2005 OEM: SDA3000DIO2BW
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 256 kbyte L2 9 October 2005 OEM: SDA3200DIO3BW
200 MHz / 2.00 GHz AMD Sempron 3400+ CPU 128 kbyte L2 10 October 2005 OEM: SDA3400DIO2BW
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 256 kbyte L2 10 October 2005 OEM: SDA3500DIO2BW

AMD Sempron processor (Processor-In-a-Box). [AMD]

AMD Sempron processor

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 62 W TDP.

Temperature: 0-69 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3000+, 3200+, 3500+ CPU ABBWE E6
AMD Sempron 3200+, 3500+ CPU LBBWE E6
AMD Sempron 3200+ CPU NBBWE E6

15.2.8  AMD Sempron processor (Manila, revision F)

Identification


Model name: Sempron.
Code name: Manila, revision F.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Sempron processor (front). [AMD]

AMD Sempron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

AMD Sempron processor (front and back). [AMD]

AMD Sempron processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 2800+ 1 CPU 128 kbyte L2 8 May 2006 OEM: SDA2800IAA2CN,
PIB: SDA2800CNBOX
200 MHz / 1.60 GHz AMD Sempron 3000+ 1 CPU 256 kbyte L2 8 May 2006 OEM: SDA3000IAA3CN,
PIB: SDA3000CNBOX
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 128 kbyte L2 9 May 2006 OEM: SDA3200IAA2CN,
OEM: SDA3200IAA2CW,
PIB: SDA3200CNBOX,
PIB: SDA3200CWBOX,
WOF: SDA3200CWWOF
200 MHz / 1.80 GHz AMD Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SDA3400IAA3CN,
OEM: SDA3400IAA3CW,
PIB: SDA3400CNBOX,
PIB: SDA3400CWBOX
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 128 kbyte L2 10 May 2006 OEM: SDA3500IAA2CN,
OEM: SDA3500IAA2CW,
PIB: SDA3500CNBOX
200 MHz / 2.00 GHz AMD Sempron 3600+ CPU 256 kbyte L2 10 May 2006 OEM: SDA3600IAA3CN,
OEM: SDA3600IAA3CW,
PIB: SDA3600CNBOX,
PIB: SDA3600CWBOX
200 MHz / 2.20 GHz AMD Sempron 3800+ CPU 256 kbyte L2 11 October 2006 OEM: SDA3800IAA3CN,
PIB: SDA3800CNBOX

  1. no Cool'n'Quiet (CnQ) power management

AMD Sempron processor (Socket AM2, Processor-In-a-Box). [AMD]

AMD Sempron processor

Physics


Voltage: 1.25-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 55-69 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 2800+, 3000+, 3400+ CPU LBBVF F2
AMD Sempron 3200+ CPU LEDBF F2
AMD Sempron 2800+, 3000+ CPU LFBCF F2
AMD Sempron 3000+, 3500+ CPU NBBVF F2

15.2.9  AMD Sempron processor (Manila, revision F, Energy Efficient Small Form Factor)

Identification


Model name: Sempron.
Code name: Manila, revision F, Energy Efficient Small Form Factor.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

AMD Sempron processor (front and back). [AMD]

AMD Sempron processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 3000+ 1 CPU 256 kbyte L2 8 May 2006 OEM: SDD3000IAA3CN,
PIB: SDD3000CNBOX
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 128 kbyte L2 9 May 2006 OEM: SDD3200IAA2CN,
PIB: SDD3200CNBOX
200 MHz / 1.80 GHz AMD Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SDD3400IAA3CN,
PIB: SDD3400CBNOX
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 128 kbyte L2 10 May 2006 OEM: SDD3500IAA2CN,
PIB: SDD3500CBNOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.20/1.25 V.
Power dissipation: 35 W TDP.

Temperature: max. 55-78 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3400+ CPU LBBVF F2

15.2.10  AMD Sempron processor (Sparta, revision G, Energy Efficient)

Identification


Model name: Sempron.
Code name: Sparta, revision G, Energy Efficient.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Voltage Temperature Introduction Order part numbers
200 MHz / 1.9 GHz AMD Sempron LE-1100 CPU 256 kbyte L2 9.5 1.25-1.35 V max. 55-65 °C October 2007 OEM (stepping G1): SDH1100IAA3DE,
PIB (stepping G1): SDH1100DEBOX,
PIB (stepping G1): SDH1100DPBOX
200 MHz / 2.0 GHz AMD Sempron LE-1150 CPU 256 kbyte L2 10 1.25-1.35 V max. 61-75 °C August 2007 OEM (stepping G1): SDH1150IAA3DE,
PIB (stepping G1): SDH1150DEBOX,
PIB (stepping G1): SDH1150DPBOX
200 MHz / 2.1 GHz AMD Sempron LE-1200 CPU 512 kbyte L2 10.5 1.20-1.40 V max. 65 °C   OEM (stepping G1): SDH1200IAA4DE,
PIB (stepping G1): SDH1200DEBOX
200 MHz / 2.1 GHz AMD Sempron LE-1200 CPU 512 kbyte L2 10.5 1.20-1.40 V   October 2007 OEM (stepping G2): SDH1200IAA4DP,
PIB (stepping G2): SDH1200DPBOX
200 MHz / 2.2 GHz AMD Sempron LE-1250 CPU 512 kbyte L2 11 1.20-1.40 V max. 75 °C October 2007 OEM (stepping G2): SDH1250IAA4DP,
PIB (stepping G2): SDH1250DPBOX
200 MHz / 2.3 GHz AMD Sempron LE-1300 CPU 512 kbyte L2 11.5 1.20-1.40 V max. 75 °C January 2008 OEM (stepping G2): SDH1300IAA4DP,
PIB (stepping G2): SDH1300DPBOX

Physics


Power dissipation: 45 W TDP.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

15.3  AMD Mobile Athlon 64 processor


15.3.1  AMD Athlon XP-M processor (Dublin, revision CG)

Identification


Model name: Athlon XP-M.
Code name: Dublin, revision CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200/1600 MHz AMD Athlon XP-M 2800+ CPU 128 kbyte L2 8 May 2004 OEM (model 8): AHN2800BIX2AY,
OEM (stepping CG): AHN2800BIX2AX
200/1600 MHz AMD Athlon XP-M 3000+ CPU 256 kbyte L2 8 July 2004 OEM (stepping CG): AHN3000BIX3AY
200/1800 MHz AMD Athlon XP-M 3100+ CPU 256 kbyte L2 9   OEM (model 8): AHN3100BIX3Y,
OEM (stepping CG): AHN3100BIX3X

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 13-62 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.3.2  AMD Mobile Athlon 64 processor (Clawhammer, revision C0, CG, Desktop Replacement)

Identification


Model name: Mobile Athlon 64.
Code name: Clawhammer, revision C0, CG, Desktop Replacement.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte.

AMD Mobile Athlon 64 processor (front and back). [AMD]

AMD Mobile Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Mobile Athlon 64 2700+ 1 CPU 8   OEM (stepping C0): AMA2700BEY4AP
200/1600 MHz AMD Mobile Athlon 64 2800+ CPU 8 February 2004 OEM (stepping C0): AMA2800BEX5AP,
OEM (stepping CG): AMA2800BEX5AR
200/1800 MHz AMD Mobile Athlon 64 3000+ CPU 9 September 2003 OEM (stepping C0): AMA3000BEX5AP,
OEM (stepping CG): AMA3000BEX5AR
200/2000 MHz AMD Mobile Athlon 64 3200+ CPU 10 September 2003 OEM (stepping C0): AMA3200BEX5AP,
OEM (stepping CG): AMA3200BEX5AR
200/2200 MHz AMD Mobile Athlon 64 3400+ CPU 11 September 2003 OEM (stepping C0): AMA3400BEX5AP,
OEM (stepping CG): AMA3400BEX5AR
200/2400 MHz AMD Mobile Athlon 64 3700+ CPU 12 September 2003 OEM (stepping C0): AMA3700BEX5AP,
OEM (stepping CG): AMA3700BEX5AR

  1. 512 kbyte L2 cache (other 512 kbyte disfunctional/disabled)

AMD Mobile Athlon 64 die plot. [AMD]

AMD Mobile Athlon 64 die plot

Physics


Voltage: 1.10-1.50 V.
Power dissipation: 19.0-81.5 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels:

  • C0,
  • CG (August 17, 2004).

15.3.3  AMD Mobile Athlon 64 processor (Clawhammer, revision C0, CG, 62 W TDP)

Identification


Model name: Mobile Athlon 64.
Code name: Clawhammer, revision C0, CG, 62 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front and back). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Mobile Athlon 64 2800+ CPU 8 September 2003 OEM (stepping C0): AMN2800BIX5AP,
OEM (stepping CG): AMN2800BIX5AR
200/1800 MHz AMD Mobile Athlon 64 3000+ CPU 9 September 2003 OEM (stepping C0): AMN3000BIX5AP,
OEM (stepping CG): AMN3000BIX5AR
200/2000 MHz AMD Mobile Athlon 64 3200+ CPU 10 September 2003 OEM (stepping C0): AMN3200BIX5AP,
OEM (stepping CG): AMN3200BIX5AR
200/2200 MHz AMD Mobile Athlon 64 3400+ CPU 11 February 2004 OEM (stepping CG): AMN3400BIX5AR

AMD Mobile Athlon 64 processor (back). [AMD]

AMD Mobile Athlon 64 processor

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 13-62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: C0, CG.

15.3.4  AMD Mobile Athlon 64 processor (Clawhammer, revision CG, 35 W TDP)

Identification


Model name: Mobile Athlon 64.
Code name: Clawhammer, revision CG, 35 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front and back). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte (other 512 kbyte disfunctional/disabled).

AMD Mobile Athlon 64 processor (front and back). [AMD]

AMD Mobile Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Mobile Athlon 64 2700+ CPU 8 May 2004 OEM (stepping CG): AMD2700BQX4AR

AMD Mobile Athlon 64 die plot. [AMD]

AMD Mobile Athlon 64 die plot

Physics


Voltage: 1.20 V.
Power dissipation: 35 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.3.5  AMD Mobile Athlon 64 processor (Odessa, revision CG, Desktop Replacement)

Identification


Model name: Mobile Athlon 64.
Code name: Odessa, revision CG, Desktop Replacement.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Mobile Athlon 64 2800+ CPU 8 April 2004 OEM: AMA2800BEX4AX

Physics


Voltage: 1.10-1.50 V.
Power dissipation: 19.0-81.5 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.3.6  AMD Mobile Athlon 64 processor (Odessa, revision CG, Low Power, 35 W TDP)

Identification


Model name: Mobile Athlon 64.
Code name: Odessa, revision CG, Low Power, 35 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Mobile Athlon 64 2700+ CPU 8 May 2004 OEM: AMD2700BQX4AX
200/1800 MHz AMD Mobile Athlon 64 2800+ CPU 9 May 2004 OEM: AMD2800BQX4AX
200/2000 MHz AMD Mobile Athlon 64 3000+ CPU 10 May 2004 OEM: AMD3000BQX4AX

Physics


Voltage: 0.90-1.20 V.
Power dissipation: 12-35 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

15.3.7  AMD Mobile Athlon 64 processor (Oakville, revision D0, Low Power, 35 W TDP)

Identification


Model name: Mobile Athlon 64.
Code name: Oakville, revision D0, Low Power, 35 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1600 MHz AMD Mobile Athlon 64 2700+ CPU 8 August 2004 OEM: AMD2700BKX4LB
200/1800 MHz AMD Mobile Athlon 64 2800+ CPU 9 August 2004 OEM: AMD2800BKX4LB
200/2000 MHz AMD Mobile Athlon 64 3000+ CPU 10 August 2004 OEM: AMD3000BKX4LB

Physics


Voltage: 1.35 V.
Power dissipation: 12-35 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

15.3.8  AMD Mobile Athlon 64 processor (Newark, revision E5, 62 W TDP)

Identification


Model name: Mobile Athlon 64.
Code name: Newark, revision E5, 62 W TDP.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Mobile Athlon 64 processor (front). [AMD]

AMD Mobile Athlon 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte.

AMD Mobile Athlon 64 processor (front and back). [AMD]

AMD Mobile Athlon 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1800 MHz AMD Mobile Athlon 64 3000+ CPU 9 April 2005 OEM: AMN3000BKX5BU
200/2000 MHz AMD Mobile Athlon 64 3200+ CPU 10 April 2005 OEM: AMN3200BKX5BU
200/2200 MHz AMD Mobile Athlon 64 3400+ CPU 11 April 2005 OEM: AMN3400BKX5BU
200/2400 MHz AMD Mobile Athlon 64 3700+ CPU 12 April 2005 OEM: AMN3700BKX5BU
200/2600 MHz AMD Mobile Athlon 64 4000+ CPU 13 August 2005 OEM: AMN4000BKX5BU

Physics


Voltage: 1.35 V.
Power dissipation: 62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: SH-E5.

15.4  AMD Turion 64 processor


15.4.1  AMD Turion 64 ML series processor (Lancaster)

Identification


Model name: Turion 64 ML series.
Code name: Lancaster.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Turion 64 processor (front and back). [AMD]

AMD Turion 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte or 512 kbyte (other 512 kbyte disfunctional/disabled).

AMD Turion 64 processor (front). [AMD]

AMD Turion 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Turion 64 ML-28 CPU 512 kbyte L2 8 June 2005 OEM: TMDML28BKX4LD
200 MHz / 1.60 GHz AMD Turion 64 ML-30 CPU 1024 kbyte L2 8 March 2005 OEM: TMDML30BKX5LD
200 MHz / 1.80 GHz AMD Turion 64 ML-32 CPU 512 kbyte L2 9 March 2005 OEM: TMDML32BKX4LD
200 MHz / 1.80 GHz AMD Turion 64 ML-34 CPU 1024 kbyte L2 9 March 2005 OEM: TMDML34BKX5LD
200 MHz / 2.00 GHz AMD Turion 64 ML-37 CPU 1024 kbyte L2 10 March 2005 OEM: TMDML37BKX5LD
200 MHz / 2.20 GHz AMD Turion 64 ML-40 CPU 1024 kbyte L2 11 June 2005 OEM: TMDML40BKX5LD
200 MHz / 2.40 GHz AMD Turion 64 ML-42 CPU 512 kbyte L2 12 October 2005 OEM: TMDML42BKX4LD
200 MHz / 2.40 GHz AMD Turion 64 ML-44 CPU 1024 kbyte L2 12 January 2006 OEM: TMDML44BKX5LD

AMD Turion 64 processor (back). [AMD]

AMD Turion 64 processor

Physics


Voltage: 1.35 V.
Power dissipation: 35 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E5.

S-Spec / Stepping code


Model Code Stepping
AMD Turion 64 ML-42 CPU AABUE E5
AMD Turion 64 ML-28, ML-30, ML-32, ML-37, ML-40 CPU CABSE E5
AMD Turion 64 ML-28, ML-30, ML-32, ML-44 CPU CABUE E5
AMD Turion 64 ML-30, ML-40, ML-42 CPU CABZE E5
AMD Turion 64 ML-30, ML-34, ML-37, ML-40 CPU GABSE E5

15.4.2  AMD Turion 64 MT series processor (Lancaster)

Identification


Model name: Turion 64 MT series.
Code name: Lancaster.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Turion 64 processor (front). [AMD]

AMD Turion 64 processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1024 kbyte or 512 kbyte (other 512 kbyte disfunctional/disabled).

AMD Turion 64 processor (front). [AMD]

AMD Turion 64 processor

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Turion 64 MT-28 CPU 512 kbyte L2 8 June 2005 OEM: TMSMT28BQX4LD
200 MHz / 1.60 GHz AMD Turion 64 MT-30 CPU 1024 kbyte L2 8 March 2005 OEM: TMSMT30BQX5LD
200 MHz / 1.80 GHz AMD Turion 64 MT-32 CPU 512 kbyte L2 9 March 2005 OEM: TMSMT32BQX4LD,
WOF: TMSMT32LDWOF
200 MHz / 1.80 GHz AMD Turion 64 MT-34 CPU 1024 kbyte L2 9 March 2005 OEM: TMSMT34BQX5LD,
WOF: TMSMT34LDWOF
200 MHz / 2.00 GHz AMD Turion 64 MT-37 CPU 1024 kbyte L2 10 August 2005 OEM: TMSMT37BQX5LD,
POW: TMSMT37LDWOF
200 MHz / 2.20 GHz AMD Turion 64 MT-40 CPU 1024 kbyte L2 11 August 2005 OEM: TMSMT40BQX5LD
200 MHz / 2.40 GHz AMD Turion 64 MT-42 CPU 512 kbyte L2 12 Q1 2006 OEM: TMSMT42BQX4LD,
never released
200 MHz / 2.40 GHz AMD Turion 64 MT-44 CPU 1024 kbyte L2 12 Q1 2006 OEM: TMSMT44BQX5LD,
never released

AMD Turion 64 processor (front and back). [AMD]

AMD Turion 64 processor

Physics


Voltage: 1.20 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E5.

S-Spec / Stepping code


Model Code Stepping
AMD Turion 64 MT-30, MT-34, MT-37 CPU CABSE E5
AMD Turion 64 MT-28 CPU CABUE E5
AMD Turion 64 MT-32, MT-34, MT-37, MT-40 CPU CABZE E5
AMD Turion 64 MT-34 CPU GABSE E5

15.4.3  AMD Turion 64 MK series processor (Richmond)

Identification


Model name: Turion 64 MK series.
Code name: Richmond.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte.

AMD Turion 64 processor (front and back). [AMD]

AMD Turion 64 processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200 MHz / 2.00 GHz AMD Turion 64 MK-36 CPU 10 September 2006 OEM: TMDMK36HAX4CM
200 MHz / 2.20 GHz AMD Turion 64 MK-38 CPU 11 Q1 2007 OEM: TMDMK38HAX4CM

AMD Turion 64 processor (Processor-In-a-Box, Without Fan). [AMD]

AMD Turion 64 processor

Physics


Voltage: 1.075-1.15 V.
Power dissipation: 31 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 81.1 million.

Die size: 103.1 mm2.

Packaging: Socket S1.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Turion 64 MK-38 CPU LFBCF F2
AMD Turion 64 MK-36 CPU NEBAF F2

15.5  AMD Mobile Sempron processor


15.5.1  AMD Mobile Sempron processor (Dublin, revision CG, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Dublin, revision CG, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BIX2AY
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BIX3AY
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BIX2AY

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 13-62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3000+ CPU CCAUC CG

15.5.2  AMD Mobile Sempron processor (Dublin, revision CG, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Dublin, revision CG, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMS2600BOX2LA
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMS2800BOX3LA

Physics


Voltage: 0.975-1.25 V.
Power dissipation: 9-25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 68.5 million.

Die size: 144 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: CG.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+ CPU ACAUC CG
AMD Mobile Sempron 2800+ CPU CCAUC CG

15.5.3  AMD Mobile Sempron processor (Georgetown, revision D0, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Georgetown, revision D0, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BIX2BA
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BIX3BA
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BIX2BA
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 May 2005 OEM: SMN3100BIX3BA
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 August 2005 OEM: SMN3300BIX2BA

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 3000+, 3100+ CPU CBBFD D0
AMD Mobile Sempron 3100+ CPU CBBHD D0

15.5.4  AMD Mobile Sempron processor (Sonora, revision D0, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Sonora, revision D0, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMS2600BOX2LB
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMS2800BOX3LB
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 November 2004 OEM: SMS3000BOX2LB
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 January 2005 OEM: SMS3100BOX3LB

Physics


Voltage: 0.975-1.250 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3100+ CPU ABBGD D0
AMD Mobile Sempron 3000+ CPU CBBFD D0
AMD Mobile Sempron 2600+ CPU CBBHD D0
AMD Mobile Sempron 2800+ CPU CBBID D0
AMD Mobile Sempron 2800+, 3100+ CPU LBBID D0

15.5.5  AMD Mobile Sempron processor (Albany, revision E6, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Albany, revision E6, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2005 OEM: SMN3000BIX2BX
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 July 2005 OEM: SMN3100BIX3BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 July 2005 OEM: SMN3300BIX2BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 10 January 2006 OEM: SMN3400BIX3BX
200 MHz / 2.20 GHz AMD Mobile Sempron 3600+ CPU 128 kbyte L2 11 May 2006 OEM: SMN3600BIX2BX

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BKX2BX
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BKX3BX
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BKX2BX
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9   OEM: SMN3100BKX3BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10   OEM: SMN3300BKX2BX
200 MHz / 2.00 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 10   OEM: SMN3400BKX3BX
200 MHz / 2.20 GHz AMD Mobile Sempron 3600+ CPU 128 kbyte L2 11   OEM: SMN3600BKX2BX

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 3000+ CPU ABBWE E6 (BKX interfix)

15.5.6  AMD Mobile Sempron processor (Roma, revision E6, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Roma, revision E6, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8   OEM: SMS2600BQX2LF
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2005 OEM: SMS2800BQX3LF
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2005 OEM: SMS3000BQX2LE,
OEM: SMS3000BQX2LF
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 July 2005 OEM: SMS3100BQX3LE,
OEM: SMS3100BQX3LF
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 July 2005 OEM: SMS3300BQX2LE,
OEM: SMS3300BQX2LF
200 MHz / 2.00 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 10 May 2006 OEM: SMS3400BQX3LE,
OEM: SMS3400BQX3LF

Physics


Voltage: 0.95-1.20 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 76.0 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: E6.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 2800+, 3300+ CPU ABBWE E6
AMD Mobile Sempron 2800+, 3000+, 3300+, 3400+ CPU CBBWE E6
AMD Mobile Sempron 3400+ CPU CCBWE E6

15.5.7  AMD Mobile Sempron processor (Keene, revision F2, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Keene, revision F2, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 3200+ CPU 512 kbyte L2 8 May 2006 OEM: SMS3200HAX4CM
200 MHz / 1.80 GHz AMD Mobile Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SMS3400HAX3CM
200 MHz / 1.80 GHz AMD Mobile Sempron 3500+ CPU 512 kbyte L2 9 May 2006 OEM: SMS3500HAX4CM
200 MHz / 2.00 GHz AMD Mobile Sempron 3600+ CPU 256 kbyte L2 10 October 2006 OEM: SMS3600HAX3CM

Physics


Voltage: 0.950-1.125 V.
Power dissipation: 25 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket S1.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3200+, 3600+ CPU LBBVF F2
AMD Mobile Sempron 3400+ CPU LEBAF F2

15.5.8  AMD Mobile Sempron processor (Sherman, revision G, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Sherman, revision G, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Voltage Power dissipation Introduction Order part numbers
200 MHz / 1.00 GHz AMD Mobile Sempron 2100+ fanless embedded CPU 256 kbyte L2 5 0.950-1.125 V 8 W TDP May 2007 OEM (stepping G1): SMF2100HAX3DQE
200 MHz / 2.00 GHz AMD Mobile Sempron 3600+ CPU 256 kbyte L2 10 1.125-1.200 V 25 W TDP   OEM (stepping G2): SMS3600HAX3DN
200 MHz / 2.00 GHz AMD Mobile Sempron 3700+ embedded CPU 512 kbyte L2 10 1.125-1.200 V 25 W TDP   OEM (stepping G1): SMS3700HAX4DQE
200 MHz / 2.20 GHz AMD Mobile Sempron 3800+ CPU 256 kbyte L2 11 1.125-1.200 V 31 W TDP   OEM (stepping G2): SMD3800HAX3DN
200 MHz / 2.20 GHz AMD Mobile Sempron 4000+ CPU 512 kbyte L2 11 1.125-1.200 V 31 W TDP   OEM (stepping G2): SMD4000HAX4DN

Physics


Temperature: max. 95 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3600+, 4000+ CPU AAA8G G2

15.6  AMD Athlon 64 FX processor


15.6.1  AMD Athlon 64 FX processor (Sledgehammer, revision C0, CG)

Identification


Model name: Athlon 64 FX.
Code name: Sledgehammer, revision C0, CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD President and CEO Hector Ruiz holds an Athlon 64 FX processor. [AMD]

AMD Athlon 64 FX processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Athlon 64 FX processor (front and back). [AMD]

AMD Athlon 64 FX processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided, registered PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2200 MHz AMD Athlon 64 FX-51 CPU 11 September 2003 OEM (stepping C0): ADAFX51CEP5AK,
OEM (stepping CG): ADAFX51CEP5AT,
PIB: ADAFX51BOX
200/2400 MHz AMD Athlon 64 FX-53 CPU 12 March 2004 OEM (stepping CG): ADAFX53CEP5AT
PIB: ADAFX53BOX

AMD Athlon 64 FX die plot. [AMD]

AMD Athlon 64 FX die plot

Physics


Voltage: 1.50 V.
Power dissipation: 89 W TDP.

Temperature: max. 70 °C.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: C0, CG.

15.6.2  AMD Athlon 64 FX processor (Clawhammer, revision CG)

Identification


Model name: Athlon 64 FX.
Code name: Clawhammer, revision CG.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 FX processor (front). [AMD]

AMD Athlon 64 FX processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Athlon 64 FX processor (front). [AMD]

AMD Athlon 64 FX processor

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Power dissipation Temperature Introduction Order part numbers
200/2400 MHz AMD Athlon 64 FX-53 CPU 12 89 W TDP max. 70 °C June 2004 OEM: ADAFX53DEP5AS,
PIB: ADAFX53ASBOX
200/2600 MHz AMD Athlon 64 FX-55 CPU 13 104 W TDP max. 63 °C October 2004 OEM: ADAFX55DEI5AS,
PIB: ADAFX55ASBOX

Physics


Voltage: 1.50 V.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: CG.

15.6.3  AMD Athlon 64 FX processor (San Diego, revision E4)

Identification


Model name: Athlon 64 FX.
Code name: San Diego, revision E4.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Athlon 64 FX processor (front). [AMD]

AMD Athlon 64 FX processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Athlon 64 FX die plot. [AMD]

AMD Athlon 64 FX die plot

Architecture


128 bit (dual-channel), 200 MHz, DDR memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2600 MHz AMD Athlon 64 FX-55 CPU 13 April 2005 OEM: ADAFX55DAA5BN,
PIB: ADAFX55BNBOX
200/2800 MHz AMD Athlon 64 FX-57 CPU 14 June 2005 OEM: ADAFX57DAA5BN,
PIB: ADAFX57BNBOX

AMD Athlon 64 FX processor (Processor-In-a-Box). [AMD]

AMD Athlon 64 FX processor

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 104 W TDP.

Temperature: max. 49-63 °C.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E4.

15.7  AMD Opteron processor

Multi-processing


Multi-processor support:

  • 1xx series: single processor,
  • 2xx series: dual processor,
  • 8xx series: for configurations with 4 or 8 processors.


15.7.1  AMD Opteron UP 100 series processor (Sledgehammer)

Identification


Model name: Opteron UP 100 series.
Code name: Sledgehammer.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD President and CEO Hector Ruiz holds an Opteron processor. [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Opteron processor architecture. [AMD]

AMD Opteron processor architecture

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).
Step level B supports only PC2700R modules.

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: single processor only.

Multiplier


Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1400 MHz AMD Opteron 140 1 CPU 7 84.7 W TDP June 2003 OEM (stepping B3): OSA140CCO5AG,
PIB (stepping B3): OSA140BOX
200/1400 MHz AMD Opteron 140 CPU 7 82.1 W TDP September 2003 OEM (stepping C0): OSA140CEP5AK,
PIB (stepping C0): OSA140BOX,
OEM (stepping CG): OSA140CEP5AT,
PIB (stepping CG): OSA140ATBOX
200/1600 MHz AMD Opteron 142 1 CPU 8 84.7 W TDP June 2003 OEM (stepping B3): OSA142CCO5AG,
PIB (stepping B3): OSA142BOX
200/1600 MHz AMD Opteron 142 CPU 8 82.1 W TDP September 2003 OEM (stepping C0): OSA142CEP5AK,
PIB (stepping C0): OSA142BOX,
OEM (stepping CG): OSA142CEP5AT,
PIB (stepping CG): OSA142ATBOX
200/1800 MHz AMD Opteron 144 1 CPU 9 84.7 W TDP June 2003 OEM (stepping B3): OSA144CCO5AG,
PIB (stepping B3): OSA144BOX
200/1800 MHz AMD Opteron 144 CPU 9 82.1 W TDP September 2003 OEM (stepping C0): OSA144CEP5AK,
PIB (stepping C0): OSA144BOX,
OEM (stepping CG): OSA144CEP5AT,
PIB (stepping CG): OSA144ATBOX
200/2000 MHz AMD Opteron 146 CPU 10 89 W TDP September 2003 OEM (stepping C0): OSA146CEP5AK,
PIB (stepping C0): OSA146BOX,
OEM (stepping CG): OSA146CEP5AT,
PIB (stepping CG): OSA146ATBOX
200/2200 MHz AMD Opteron 148 CPU 11 89 W TDP November 2003 OEM (stepping C0): OSA148CEP5AK,
PIB (stepping C0): OSA148BOX,
OEM (stepping CG): OSA148CEP5AT,
PIB (stepping CG): OSA148ATBOX
Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/2400 MHz AMD Opteron 150 CPU 12 89 W TDP June 2004 OEM (stepping CG): OSA150CEP5AT,
PIB (stepping CG): OSA150ATBOX

  1. supports only PC2700R memory modules

AMD Opteron die plot. [AMD]

AMD Opteron die plot

Physics


Voltage:

  • step level B3: 1.55 V,
  • step level C0, CG: 1.50 V.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: B3, C0, CG.

15.7.2  AMD Opteron UP HE 100 series processor (Sledgehammer, High Efficiency)

Identification


Model name: Opteron UP HE 100 series.
Code name: Sledgehammer, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Opteron processor (front and back). [AMD]

AMD Opteron processor

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: single processor only.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 146 HE CPU 10 March 2004 OEM (stepping CG): OSK146CMP5AT,
PIB (stepping CG): OSK146ATBOX

Physics


Voltage: 1.30 V.
Power dissipation: 55 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: CG.

15.7.3  AMD Opteron UP EE 100 series processor (Sledgehammer, Energy Efficiency)

Identification


Model name: Opteron UP EE 100 series.
Code name: Sledgehammer, Energy Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: single processor only.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1400 MHz AMD Opteron 140 EE CPU 7 March 2004 OEM (stepping CG): OSB140CSP5AT

Physics


Voltage: 1.15 V.
Power dissipation: 30 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: CG.

15.7.4  AMD Opteron DP 200 series processor (Sledgehammer)

Identification


Model name: Opteron DP 200 series.
Code name: Sledgehammer.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).
Step level B supports only PC2700R modules.

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: dual processor.

Multiplier


Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1400 MHz AMD Opteron 240 1 CPU 7 84.7 W TDP April 2003 OEM (stepping B3): OSA240CCO5AH,
PIB (stepping B3): OSA240BOX
200/1400 MHz AMD Opteron 240 CPU 7 82.1 W TDP August 2003 OEM (stepping C0): OSA240CEP5AL,
PIB (stepping C0): OSA240BOX,
OEM (stepping CG): OSA240CEP5AU,
PIB (stepping CG): OSA240AUBOX
200/1600 MHz AMD Opteron 242 1 CPU 8 84.7 W TDP April 2003 OEM (stepping B3): OSA242CCO5AH,
PIB (stepping B3): OSA242BOX
200/1600 MHz AMD Opteron 242 CPU 8 82.1 W TDP August 2003 OEM (stepping C0): OSA242CEP5AL,
PIB (stepping C0): OSA242BOX,
OEM (stepping CG): OSA242CEP5AU,
PIB (stepping CG): OSA242AUBOX
200/1800 MHz AMD Opteron 244 1 CPU 9 84.7 W TDP April 2003 OEM (stepping B3): OSA244CCO5AH,
PIB (stepping B3): OSA244BOX
200/1800 MHz AMD Opteron 244 CPU 9 82.1 W TDP August 2003 OEM (stepping C0): OSA244CEP5AL,
PIB (stepping C0): OSA244BOX,
OEM (stepping CG): OSA244CEP5AU,
PIB (stepping CG): OSA244AUBOX
200/2000 MHz AMD Opteron 246 CPU 10 89 W TDP August 2003 OEM (stepping C0): OSA246CEP5AL,
PIB (stepping C0): OSA246BOX,
OEM (stepping CG): OSA246CEP5AU,
PIB (stepping CG): OSA246AUBOX
200/2200 MHz AMD Opteron 248 CPU 11 89 W TDP November 2003 OEM (stepping C0): OSA248CEP5AL,
PIB (stepping C0): OSA248BOX,
OEM (stepping CG): OSA248CEP5AU,
PIB (stepping CG): OSA248AUBOX
Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/2400 MHz AMD Opteron 250 CPU 12 89 W TDP June 2004 OEM (stepping CG): OSA250CEP5AU,
PIB (stepping CG): SA250AUBOX

  1. supports only PC2700R memory modules

AMD Opteron 246 processor (Processor-In-a-Box). [AMD]

AMD Opteron 246 processor

Physics


Voltage:

  • step level B: 1.55 V,
  • step level C0, CG: 1.50 V.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: B3, C0, CG.

15.7.5  AMD Opteron DP HE 200 series processor (Sledgehammer, High Efficiency)

Identification


Model name: Opteron DP HE 200 series.
Code name: Sledgehammer, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Opteron processor (front and back). [AMD]

AMD Opteron processor

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: dual processor.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 246 HE CPU 10 March 2004 OEM (stepping CG): OSK246CMP5AU,
PIB (stepping CG): OSK246AUBOX

Physics


Voltage: 1.30 V.
Power dissipation: 55 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: CG.

15.7.6  AMD Opteron DP EE 200 series processor (Sledgehammer, Energy Efficiency)

Identification


Model name: Opteron DP EE 200 series.
Code name: Sledgehammer, Energy Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processors. [AMD]

AMD Opteron processors

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: dual processor.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1400 MHz AMD Opteron 240 EE CPU 7 March 2004 OEM (stepping CG): OSB240CSP5AU

Physics


Voltage: 1.15 V.
Power dissipation: 30 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: CG.

15.7.7  AMD Opteron MP 800 series processor (Sledgehammer)

Identification


Model name: Opteron MP 800 series.
Code name: Sledgehammer.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Opteron processor (front and back). [AMD]

AMD Opteron processor

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).
Step level B supports only PC2700R modules.

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: for configurations with 4 or 8 processors.

Multiplier


Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1400 MHz AMD Opteron 840 1 CPU 7 84.7 W TDP June 2003 OEM (stepping B3): OSA840CCO5AI
200/1400 MHz AMD Opteron 840 CPU 7 82.1 W TDP August 2003 OEM: (stepping C0): OSA840CEP5AM,
OEM (stepping CG): OSA840CEP5AV
200/1600 MHz AMD Opteron 842 1 CPU 8 84.7 W TDP June 2003 OEM (stepping B3): OSA842CCO5AI
200/1600 MHz AMD Opteron 842 CPU 8 82.1 W TDP August 2003 OEM (stepping C0): OSA842CEP5AM,
OEM (stepping CG): OSA842CEP5AV
200/1800 MHz AMD Opteron 844 1 CPU 9 84.7 W TDP June 2003 OEM (stepping B3): OSA844CCO5AI
200/1800 MHz AMD Opteron 844 CPU 9 82.1 W TDP August 2003 OEM (stepping C0): OSA844CEP5A,
OEM (stepping CG): OSA844CEP5AV
200/2000 MHz AMD Opteron 846 CPU 10 89 W TDP September 2003 OEM (stepping C0): OSA846CEP5AM,
OEM (stepping CG): OSA846CEP5AV
200/2200 MHz AMD Opteron 848 CPU 11 89 W TDP November 2003 OEM (stepping C0): OSA848CEP5AM,
OEM (stepping CG): OSA848CEP5AV
Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/2400 MHz AMD Opteron 850 CPU 12 89 W TDP June 2004 OEM (stepping CG): OSA850CEP5AV

  1. supports only PC2700R memory modules

AMD Opteron 842 processor (Processor-In-a-Box, Without Fan). [AMD]

AMD Opteron 842 processor

Physics


Voltage:

  • step level B: 1.55 V,
  • step level C0, CG: 1.50 V.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: B3, C0, CG.

15.7.8  AMD Opteron MP HE 800 series processor (Sledgehammer, High Efficiency)

Identification


Model name: Opteron MP HE 800 series.
Code name: Sledgehammer, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

AMD Opteron processor (front and back). [AMD]

AMD Opteron processor

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: for configurations with 4 or 8 processors.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 846 HE CPU 10 March 2004 OEM (stepping CG): OSK846CMP5AV

Physics


Voltage: 1.30 V.
Power dissipation: 55 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: CG.

15.7.9  AMD Opteron MP EE 800 series processor (Sledgehammer, Energy Efficiency)

Identification


Model name: Opteron MP EE 800 series.
Code name: Sledgehammer, Energy Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: for configurations with 4 or 8 processors.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/1400 MHz AMD Opteron 840 EE CPU 7 March 2004 OEM (stepping CG): OSB840CSP5AV

Physics


Voltage: 1.15 V.
Power dissipation: 30 W TDP.

Manufacturing process: 0.13 micron.

Number of transistors: 105.9 million.

Die size: 193 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: CG.

15.7.10  AMD Opteron UP 100 series processor (Venus, Socket 940)

Identification


Model name: Opteron UP 100 series.
Code name: Venus, Socket 940.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: single processor only.

Multiplier


Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1600 MHz AMD Opteron 142 CPU 8 67 W TDP December 2004 OEM (stepping E4): OSA142FAA5BK,
PIB (stepping E4): OSA142BKBOX
200/1800 MHz AMD Opteron 144 CPU 9 67 W TDP December 2004 OEM (stepping E4): OSA144FAA5BK,
PIB (stepping E4): OSA144BKBOX
200/2000 MHz AMD Opteron 146 CPU 10 67 W TDP December 2004 OEM (stepping D4): OSA146FIK5BB,
OEM (stepping E4): OSA146FAA5BK,
PIB (stepping E4): OSA146BKBOX
200/2200 MHz AMD Opteron 148 CPU 11 85.3 W TDP December 2004 OEM (stepping E4): OSA148FAA5BK,
PIB (stepping E4): OSA148BKBOX
200/2400 MHz AMD Opteron 150 CPU 12 85.3 W TDP December 2004 OEM (stepping E4): OSA150FAA5BK,
PIB (stepping E4): OSA150BKBOX
200/2600 MHz AMD Opteron 152 CPU 13 104 W TDP August 2005 OEM (stepping E4): OSA152FAA5BK,
PIB (stepping E4): OSA152BKBOX

Physics


Voltage:

  • step level D4: 1.40 V,
  • step level E4: 1.35-1.40 V.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: D4, E4.

15.7.11  AMD Opteron UP 100 series processor (Venus, Socket 939)

Identification


Model name: Opteron 100 series.
Code name: Venus, Socket 939.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Unbuffered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: single processor only.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Cancellation Order part numbers
200/1800 MHz AMD Opteron 144 CPU 9 67.0 W TDP August 2005 September 2007 OEM (stepping E4): OSA144DAA5BN,
PIB (stepping E4): OSA144BNBOX
200/2000 MHz AMD Opteron 146 CPU 10 67.0 W TDP August 2005 September 2007 OEM (stepping E4): OSA146DAA5BN,
PIB (stepping E4): OSA146BNBOX
200/2200 MHz AMD Opteron 148 CPU 11 85.3 W TDP August 2005 September 2007 OEM (stepping E4): OSA148DAA5BN,
PIB (stepping E4): OSA148BNBOX
200/2400 MHz AMD Opteron 150 CPU 12 85.3 W TDP August 2005   OEM (stepping E4): OSA150DAA5BN,
PIB (stepping E4): OSA150BNBOX
200/2600 MHz AMD Opteron 152 CPU 13 104.0 W TDP August 2005   OEM (stepping E4): OSA152DAA5BN,
PIB (stepping E4): OSA152BNBOX
200/2800 MHz AMD Opteron 154 CPU 14 104.0 W TDP August 2005   OEM (stepping E4): OSA154DAA5BN,
PIB (stepping E4): OSA154BNBOX
200/3000 MHz AMD Opteron 156 CPU 15 104 W TDP May 2006   OEM (stepping E4): OSA156DAA5BN,
PIB (stepping E4): OSA156BNBOX

AMD Opteron die plot. [AMD]

AMD Opteron die plot

Physics


Voltage: 1.35-1.40 V.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 939.

Step level


Text:

Step levels: E4.

15.7.12  AMD Opteron UP HE 100 series processor (Venus, High Efficiency)

Identification


Model name: Opteron UP HE 100 series.
Code name: Venus, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Unbuffered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: single processor only.

Multiplier


Clock speed


Clock speed Model Multiplier Cancellation Order part numbers
200/2200 MHz AMD Opteron 148 HE CPU 11 September 2007 OEM (stepping E4): OSK148FAA5BK

Physics


Voltage: 1.40 V.
Power dissipation: 54.7 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E4.

15.7.13  AMD Opteron DP 200 series processor (Troy)

Identification


Model name: Opteron DP 200 series.
Code name: Troy.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD President and CEO Hector Ruiz holds an Opteron processor. [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: dual processor.

Multiplier


Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1600 MHz AMD Opteron 242 CPU 8 85.3 W TDP December 2004 OEM (stepping E4): OSA242FAA5BL,
PIB (stepping E4): OSA242BLBOX
200/1800 MHz AMD Opteron 244 CPU 9 85.3 W TDP December 2004 OEM (stepping E4): OSA244FAA5BL,
PIB (stepping E4): OSA244BLBOX
200/2000 MHz AMD Opteron 246 CPU 10 stepping D4: 67.0 W TDP;
stepping E4: 85.3 W TDP
December 2004 OEM (stepping D4): OSA246FIK5BC, OSA246FIK5BC7
OEM (stepping E4): OSA246FAA5BL,
PIB (stepping E4): OSA246BLBOX
200/2200 MHz AMD Opteron 248 CPU 11 stepping D4: 67.0 W TDP;
stepping E4: 85.3 W TDP
December 2004 OEM (stepping D4): OSA248FIK5BC,
OEM (stepping E4): OSA248FAA5BL,
PIB (stepping E4): OSA248BLBOX
200/2400 MHz AMD Opteron 250 CPU 12 85.3 W TDP December 2004 OEM (stepping E4): OSA250FAA5BL,
PIB (stepping E4): OSA250BLBOX
200/2600 MHz AMD Opteron 252 CPU 13 92.6 W TDP February 2005 OEM (stepping E4): OSA252FAA5BL,
PIB (stepping E4): OSA252BLBOX
200/2800 MHz AMD Opteron 254 CPU 14 92.6 W TDP August 2005 OEM (stepping E4): OSA254FAA5BL,
PIB (stepping E4): OSA254BLBOX
200/3000 MHz AMD Opteron 256 CPU 15 92.6 W TDP April 2006 OEM (stepping E4): OSA256FAA5BL,
PIB (stepping E4): OSA256BLBOX

AMD Opteron 246 processor (Processor-In-a-Box). [AMD]

AMD Opteron 246 processor

Physics


Voltage:

  • step level D4: 1.40 V,
  • step level E4: 1.35-1.40 V.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels:

  • D0: no SSE3, 800 MHz HyperTransport bus,
  • D4,
  • E4.

15.7.14  AMD Opteron DP HE 200 series processor (Troy, High Efficiency)

Identification


Model name: Opteron DP HE 200 series.
Code name: Troy, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: dual processor.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 246 HE CPU 10 March 2005 OEM (stepping E4): OSK246FAA5BL,
PIB (stepping E4): OSK246BLBOX
200/2200 MHz AMD Opteron 248 HE CPU 11 March 2005 OEM (stepping E4): OSK248FAA5BL,
PIB (stepping E4): OSK248BLBOX, OSK248BLWOF
200/2400 MHz AMD Opteron 250 HE CPU 12 March 2005 OEM (stepping E4): OSK250FAA5BL,
PIB (stepping E4): OSK250BLBOX, OSK250BLWOF

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 54.7 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E4.

15.7.15  AMD Opteron MP 800 series processor (Athens)

Identification


Model name: Opteron MP 800 series.
Code name: Athens.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front and back). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: up to eight processors.

Multiplier


Clock speed


Clock speed Model Multiplier Power dissipation Introduction Order part numbers
200/1600 MHz AMD Opteron 842 CPU 8 85.3 W TDP December 2004 OEM (stepping E4): OSA842FAA5BM,
PIB (stepping E4): OSA842BMWOF
200/1800 MHz AMD Opteron 844 CPU 9 85.3 W TDP December OEM (stepping E4): OSA844FAA5BM,
PIB (stepping E4): OSA844BMWOF
200/2000 MHz AMD Opteron 846 CPU 10 stepping D4: 67.0 W TDP;
stepping E4: 85.3 W TDP
December 2004 OEM (stepping D4): OSA846FIK5BD,
OEM (stepping E4): OSA846FAA5BM,
PIB (stepping E4): OSA846BMWOF
200/2200 MHz AMD Opteron 848 CPU 11 85.3 W TDP December 2004 OEM (stepping E4): OSA848FAA5BM,
PIB (stepping E4): OSA848BMWOF
200/2400 MHz AMD Opteron 850 CPU 12 85.3 W TDP December 2004 OEM (stepping E4): OSA850FAA5BM,
PIB (stepping E4): OSA850BMWOF
200/2600 MHz AMD Opteron 852 CPU 13 92.6 W TDP February 2005 OEM (stepping E4): OSA852FAA5BM,
PIB (stepping E4): OSA852BMWOF
200/2800 MHz AMD Opteron 854 CPU 14 92.6 W TDP August 2005 OEM (stepping E4): OSA854FAA5BM,
PIB (stepping E4): OSA854BMWOF
200/3000 MHz AMD Opteron 856 CPU 15 92.6 W TDP April 2006 OEM (stepping E4): OSA856FAA5BM,
PIB (stepping E4): OSA856BMWOF

AMD Opteron 842 processor (Processor-In-a-Box, Without Fan). [AMD]

AMD Opteron 842 processor

Physics


Voltage:

  • step level D4: 1.40 V,
  • step level E4: 1.35-1.40 V.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: D4, E4.

15.7.16  AMD Opteron MP HE 800 series processor (Athens, High Efficiency)

Identification


Model name: Opteron MP HE 800 series.
Code name: Athens, High Efficiency.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

AMD Opteron processor (front). [AMD]

AMD Opteron processor

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 1 Mbyte.

Architecture


128 bit (dual-channel), 200 MHz, Registered DDR memory controller: max. 16 x 512 Mbyte = 8 Gbyte (8 x 1 Gbyte double-sided PC3200R memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multi-processing


Multi-processor support: up to eight processors.

Multiplier


Clock speed


Clock speed Model Multiplier Introduction Order part numbers
200/2000 MHz AMD Opteron 846 HE CPU 10 March 2005 OEM (stepping E4): OSK846FAA5BM,
PIB (stepping E4): OSK846BMBOX
200/2200 MHz AMD Opteron 848 HE CPU 11 March 2005 OEM (stepping E4): OSK848FAA5BM,
PIB (stepping E4): OSK848BMBOX
200/2400 MHz AMD Opteron 850 HE CPU 12 March 2005 OEM (stepping E4): OSK850FAA5BM,
PIB (stepping E4): OSK850BMBOX

Physics


Voltage: 1.35-1.40 V.
Power dissipation: 54.7 W TDP.

Manufacturing process: 90 nm.

Number of transistors: 114 million.

Die size: 115 mm2.

Packaging: Socket 940.

Step level


Text:

Step levels: E4.

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