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AMD Sempron processor (Manila, revision F, Energy Efficient Small Form Factor)

Identification


Model name: Sempron.
Code name: Manila, revision F, Energy Efficient Small Form Factor.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

AMD Sempron processor (front and back). [AMD]

AMD Sempron processor

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Sempron 3000+ 1 CPU 256 kbyte L2 8 May 2006 OEM: SDD3000IAA3CN,
PIB: SDD3000CNBOX
200 MHz / 1.80 GHz AMD Sempron 3200+ CPU 128 kbyte L2 9 May 2006 OEM: SDD3200IAA2CN,
PIB: SDD3200CNBOX
200 MHz / 1.80 GHz AMD Sempron 3400+ CPU 256 kbyte L2 9 May 2006 OEM: SDD3400IAA3CN,
PIB: SDD3400CBNOX
200 MHz / 2.00 GHz AMD Sempron 3500+ CPU 128 kbyte L2 10 May 2006 OEM: SDD3500IAA2CN,
PIB: SDD3500CBNOX

  1. no Cool'n'Quiet (CnQ) power management

Physics


Voltage: 1.20/1.25 V.
Power dissipation: 35 W TDP.

Temperature: max. 55-78 °C.

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 103.1 million.

Die size: 81.1 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level


Text:

Step levels: F2.

S-Spec / Stepping code


Model Code Stepping
AMD Sempron 3400+ CPU LBBVF F2

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