Model name:
Sempron.
Code name:
Manila, revision F, Energy Efficient Small Form Factor.
Family name:
Cities.
Supplier:
AMD.
Component class:
CPU.
Generation: K8.
64 bit technology: AMD64.
Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.
L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).
AMD Sempron processor
128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).
800 MHz HyperTransport bus.
Memory protection: NX bit (Enhanced Virus Protection, EVP).
No virtualization technology.
Power management: Cool'n'Quiet (CnQ).
|
|
Clock speed | Model | Cache | Multiplier | Introduction | Order part numbers |
---|---|---|---|---|---|
200 MHz / 1.60 GHz | AMD Sempron 3000+ 1 CPU | 256 kbyte L2 | 8 | May 2006 |
OEM: SDD3000IAA3CN, PIB: SDD3000CNBOX |
200 MHz / 1.80 GHz | AMD Sempron 3200+ CPU | 128 kbyte L2 | 9 | May 2006 |
OEM: SDD3200IAA2CN, PIB: SDD3200CNBOX |
200 MHz / 1.80 GHz | AMD Sempron 3400+ CPU | 256 kbyte L2 | 9 | May 2006 |
OEM: SDD3400IAA3CN, PIB: SDD3400CBNOX |
200 MHz / 2.00 GHz | AMD Sempron 3500+ CPU | 128 kbyte L2 | 10 | May 2006 |
OEM: SDD3500IAA2CN, PIB: SDD3500CBNOX |
Voltage: 1.20/1.25 V.
Power dissipation: 35 W TDP.
Temperature: max. 55-78 °C.
Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.
Number of transistors: 103.1 million.
Die size: 81.1 mm2.
Packaging: Socket AM2.
Manufactured in: AMD Fab 30/36, Dresden, Germany.
Step levels: F2.
Model | Code | Stepping |
---|---|---|
AMD Sempron 3400+ CPU | LBBVF | F2 |
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