The ChipList, by Adrian Offerman; The Processor Portal

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AMD Phenom X3 8xxx series Triple-Core processor (Toliman, stepping B3)

Identification


Model name: Phenom X3 8xxx series Triple-Core.
Code name: Toliman, stepping B3.
Family name: Stars.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K10.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a.

Cache


Balanced Smart Cache:

  • L1 cache: (3x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture),
    both 2-way set-associative,
  • L2 cache: (3x) 512 kbyte,
    8-way set-associative,
  • shared L3 cache: 2 Mbyte,
    32-way set-associative.

Architecture


128 bit (decoupled dual-channel), 266/533/1066 MHz, Unbuffered DDR2-1066 memory controller, supporting ECC (Error-Correcting Code): max. 8 x 1 Gbyte = 8 Gbyte (4 x 2 Gbyte double-sided PC2-8500 memory module) per processor.

1.8 GHz HyperTransport 3.0 bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica), with:

  • Rapid Virtualization Indexing: Nested Page Tables, virtual-to-physical address translation by memory controller,
  • Tagged TLB (Translation Look-aside Buffer): linking memory pages to virtual machines, no need for TLB flushes when switching virtual environments,
  • Device Exclusion Vector (DEV): managing access to memory pages by virtual machines,
  • Extended Migration: allowing virtual machines to be live migrated over the full range of Opteron processors.

Multi-processing


Triple-core technology: three cores connected through Internal System Request Queue Crossbar (fourth core disfunctional/disabled).

Multiplier


Power management


Power management: Cool'n'Quiet 2.0, with:

  • CoolCore Technology: turning off unused parts of the processor,
  • Independent Dynamic Core Technology: the clock multiplier of each core can be set independently of the other cores,
  • Dual Dynamic Power Management (DDPM): a split power plane provides an independent power supply to the cores and to the memory controller.

Clock speed


Clock speed Model Multiplier Voltage Introduction Order part numbers
200/2100 MHz AMD Phenom X3 8450 Triple-Core CPU 10.5 1.10-1.25 V April 2008 OEM: HD8450WCJ3BGH,
PIB: HD8450WCGHBOX
200/2300 MHz AMD Phenom X3 8600B Triple-Core 1 CPU 11.5 1.05-1.25 V April 2008 OEM: HD860BWCJ3BGD,
PIB: HD860BWCGDBOX
200/2300 MHz AMD Phenom X3 8650 Triple-Core CPU 11.5 1.10-1.25 V April 2008 OEM: HD8650WCJ3BGH,
PIB: HD8650WCGHBOX
200/2400 MHz AMD Phenom X3 8750 Triple-Core CPU 12 1.10-1.25 V April 2008 OEM: HD8750WCJ3BGH,
PIB: HD8750WCGHBOX

  1. Business Class: availability guaranteed for 24 months after release

Physics


Power dissipation: 95 W TDP.

Temperature: max. 70 °C.

Manufacturing process: fourth generation 65 nm, SoI (Silicon-on-Insulator), DSL (Dual Stress Liner), e-SiGe (embedded Silicon Germanium).

Number of transistors: 463 million (dimensioned for 600 million).

Die size: 285 mm2.

Packaging: Socket AM2+.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels:

  • B3: full production.

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