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AMD Mobile Sempron processor (Sherman, revision G, Low Power)

Identification


Model name: Mobile Sempron.
Code name: Sherman, revision G, Low Power.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Voltage Power dissipation Introduction Order part numbers
200 MHz / 1.00 GHz AMD Mobile Sempron 2100+ fanless embedded CPU 256 kbyte L2 5 0.950-1.125 V 8 W TDP May 2007 OEM (stepping G1): SMF2100HAX3DQE
200 MHz / 2.00 GHz AMD Mobile Sempron 3600+ CPU 256 kbyte L2 10 1.125-1.200 V 25 W TDP   OEM (stepping G2): SMS3600HAX3DN
200 MHz / 2.00 GHz AMD Mobile Sempron 3700+ embedded CPU 512 kbyte L2 10 1.125-1.200 V 25 W TDP   OEM (stepping G1): SMS3700HAX4DQE
200 MHz / 2.20 GHz AMD Mobile Sempron 3800+ CPU 256 kbyte L2 11 1.125-1.200 V 31 W TDP   OEM (stepping G2): SMD3800HAX3DN
200 MHz / 2.20 GHz AMD Mobile Sempron 4000+ CPU 512 kbyte L2 11 1.125-1.200 V 31 W TDP   OEM (stepping G2): SMD4000HAX4DN

Physics


Temperature: max. 95 °C.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 3600+, 4000+ CPU AAA8G G2

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