The ChipList, by Adrian Offerman; The Processor Portal

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AMD Mobile Sempron processor (Georgetown, revision D0, Desktop Replacement)

Identification


Model name: Mobile Sempron.
Code name: Georgetown, revision D0, Desktop Replacement.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


No 64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 256 kbyte (other 256 kbyte disfunctional/disabled) or 128 kbyte (other 384 kbyte disfunctional/disabled).

Architecture


64 bit, 200 MHz, DDR memory controller: max. 4 x 512 Mbyte = 2 Gbyte (2 x 1 Gbyte double-sided PC3200 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Multiplier


Power management


Power management: PowerNow!.

Clock speed


Clock speed Model Cache Multiplier Introduction Order part numbers
200 MHz / 1.60 GHz AMD Mobile Sempron 2600+ CPU 128 kbyte L2 8 July 2004 OEM: SMN2600BIX2BA
200 MHz / 1.60 GHz AMD Mobile Sempron 2800+ CPU 256 kbyte L2 8 July 2004 OEM: SMN2800BIX3BA
200 MHz / 1.80 GHz AMD Mobile Sempron 3000+ CPU 128 kbyte L2 9 July 2004 OEM: SMN3000BIX2BA
200 MHz / 1.80 GHz AMD Mobile Sempron 3100+ CPU 256 kbyte L2 9 May 2005 OEM: SMN3100BIX3BA
200 MHz / 2.00 GHz AMD Mobile Sempron 3300+ CPU 128 kbyte L2 10 August 2005 OEM: SMN3300BIX2BA

Physics


Voltage: 0.95-1.40 V.
Power dissipation: 62 W TDP.

Temperature: max. 95 °C.

Manufacturing process: 90 nm.

Number of transistors: 68.5 million.

Die size: 84 mm2.

Packaging: Socket 754.

Step level


Text:

Step levels: D0.

S-Spec / Stepping code


Model Code Stepping
AMD Mobile Sempron 2600+, 3000+, 3100+ CPU CBBFD D0
AMD Mobile Sempron 3100+ CPU CBBHD D0

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